Preparation of Highly Thermally Conductive Hexagonal Boron Nitride‐Polyvinyl Alcohol/Polydimethylsiloxane Composite Using Combined Freeze‐Drying and Spatial Confining Forced Network Assembly Method

Abstract

With the rapid advancement of electronic products, an increasing number of electronic components are being integrated onto chips, leading to a higher power consumption per unit area. Consequently, effective heat dissipation has become increasingly important. To address this heat dissipation challenge, this paper introduces and prepares a highly thermally conductive polymer composite (TCPC) based on freeze‐drying, coupled with the Spatial Confining Forced Network Assembly（SCFNA） method. The freeze‐drying process is used to create a three‐dimensional thermal conductive network. This network provides a well‐defined heat path. The SCFNA method enhances the regularity of the thermal conductive network within the matrix. Ultimately, This results in the significant thermal conductivity enhancement of the polymer composite. After freeze‐drying, when the mass ratio of hexagonal boron nitride (h‐BN) to polyvinyl alcohol (PVA) is 4:1, the sample prepared by SCFNA presents 72.6% higher thermal conductivity than the one obtained through direct infiltration. This achievement holds significant value for the advancement of polymer composites with high thermal conductivity and excellent mechanical properties. It can improve the low dissipation performance of polymer thermal conductive composite systems, meet the needs of high‐performance and low‐dissipation use of thermal management materials, and reduce the working temperature of electronic chips.This article is protected by copyright. All rights reserved.