2016 17th International Conference on Electronic Packaging Technology (ICEPT) 2016
DOI: 10.1109/icept.2016.7583189
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Preparation of lead-free low-melting glass and its slurry for vacuum glass packaging

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Cited by 3 publications
(4 citation statements)
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“…In this study, V 2 O 5 -P 2 O 5 -TeO 2 low-melting glass is chosen as the edge seal material based on the early research of our group. 19 This glass has expansion coefficient of 83.5 × 10 −7 /°C, which is close to that of glass sheet; low glass transition temperature of 339.3°C; and sealing temperature between 430°C and 470°C. These properties make the V 2 O 5 -P 2 O 5 -TeO 2 low-melting glass perfect to be the sealant of vacuum gap of vacuum glazing.…”
Section: Introductionmentioning
confidence: 55%
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“…In this study, V 2 O 5 -P 2 O 5 -TeO 2 low-melting glass is chosen as the edge seal material based on the early research of our group. 19 This glass has expansion coefficient of 83.5 × 10 −7 /°C, which is close to that of glass sheet; low glass transition temperature of 339.3°C; and sealing temperature between 430°C and 470°C. These properties make the V 2 O 5 -P 2 O 5 -TeO 2 low-melting glass perfect to be the sealant of vacuum gap of vacuum glazing.…”
Section: Introductionmentioning
confidence: 55%
“…Therefore, the thermal expansion coefficient of solder glass must match the plane sheet. In this study, V 2 O 5 ‐P 2 O 5 ‐TeO 2 low‐melting glass is chosen as the edge seal material based on the early research of our group . This glass has expansion coefficient of 83.5 × 10 −7 /°C, which is close to that of glass sheet; low glass transition temperature of 339.3°C; and sealing temperature between 430°C and 470°C.…”
Section: Introductionmentioning
confidence: 99%
“…Shear strength reflects the bonding between low‐melting glass and glass substrates, is vital to the lifecycle of vacuum glazing. Based on our previous work, 42 the main process parameters of anodic‐bonding refer to bonding temperature, bonding time and bonding voltage. To optimize process parameters, vacuum glazing samples were divided into three groups: T1–T8 (samples sealed at different temperatures), t1–t8 (samples sealed for different times), and V1–V14 (samples sealed under different voltages).…”
Section: Resultsmentioning
confidence: 99%
“…Lu first adopted anodic‐bonding technique to seal the vacuum gap using In‐Sn alloy solder for fabrication of vacuum glazing 41 . Very recently, we reported the low‐melting glasses of V 2 O 5 –P 2 O 5 –TeO 2 42–43 and V 2 O 5 –P 2 O 5 –B 2 O 3 44 system were chosen as the edge sealing material for the fabrication of vacuum glazing, and the enhanced sealing performance with the assistance of anodic‐bonding method was investigated.…”
Section: Introductionmentioning
confidence: 99%