Preparation of liquid metal circuits on flexible polymers by selective laser ablation: Essential mechanism of non-conductivity in ablation part

Xiao, Chengchao; Zhang, Huiyuan; Zhao, Huaiyu; Xu, Haoran; Huang, Jiameng; Zhou, Tao

doi:10.1016/j.apsusc.2022.154746

Cited by 11 publications

(5 citation statements)

References 52 publications

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“…[85] Particularly, a mask and ink free method was conducted by Xiao et al first a roller coating of LMs on substrates, unnecessary areas were laser ablated using intense NIR or UV lasers, resulting in conductive path residual on stretchable substrates with high-precision, a resistive sensor was built for monitoring human activities. [178] And Yu et al demonstrated a non-contact, voltage induced electrochemical lithography for patterning liquid metals, in this technique, adjustable pattern of the electrode determines the pattern of liquid metals and the methods enabled fast formation speed of liquid metal patterns over 76 mm s −1 . [179] Notably, Ma et al simply patterning LM on substrates using a magnet shown in Figure 12b.…”

Section: Other Pattering Methodsmentioning

confidence: 99%

Room‐Temperature Liquid Metals for Flexible Electronic Devices

Lu,

Ni,

Jiang

et al. 2023

Small

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Room‐temperature gallium‐based liquid metals (RT‐GaLMs) have garnered significant interest recently owing to their extraordinary combination of fluidity, conductivity, stretchability, self‐healing performance, and biocompatibility. They are ideal materials for the manufacture of flexible electronics. By changing the composition and oxidation of RT‐GaLMs, physicochemical characteristics of the liquid metal can be adjusted, especially the regulation of rheological, wetting, and adhesion properties. This review highlights the advancements in the liquid metals used in flexible electronics. Meanwhile related characteristics of RT‐GaLMs and underlying principles governing their processing and applications for flexible electronics are elucidated. Finally, the diverse applications of RT‐GaLMs in self‐healing circuits, flexible sensors, energy harvesting devices, and epidermal electronics, are explored. Additionally, the challenges hindering the progress of RT‐GaLMs are discussed, while proposing future research directions and potential applications in this emerging field. By presenting a concise and critical analysis, this paper contributes to the advancement of RT‐GaLMs as an advanced material applicable for the new generation of flexible electronics.

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Section: Other Pattering Methodsmentioning

confidence: 99%

Room‐Temperature Liquid Metals for Flexible Electronic Devices

Lu,

Ni,

Jiang

et al. 2023

Small

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“…However, the application of laser technology in flexible manufacturing extends beyond this principle. Depending on the application and development of the laser, there are already a variety of flexible product creation solutions based on laser technology [ 61 , 95 , 96 , 97 , 104 , 105 , 106 , 107 , 108 , 109 , 110 ].…”

Section: Simple Flexible Device Preparationmentioning

confidence: 99%

“…The preparation of multilayer devices typically involves multiple complex processes, with a crucial focus on achieving an effective and reliable electrical connection between the layers. Marques et al [ 102 ] successfully prepared multilayer stretchable hybrid circuits using a combination of inkjet printing, metal etching, laser ablation, coating, liquid metal (LM)-filled vertical interconnect accesses (VIAs), and spray plating [ 38 , 110 , 131 , 132 ]. Figure 15 A illustrates the principal disassembly diagram of their approach.…”

Section: Stacking Process: Complex Multilayer Flexible Device Prepara...mentioning

confidence: 99%

A Review of Manufacturing Methods for Flexible Devices and Energy Storage Devices

Han,

Cui,

Liu

et al. 2023

Biosensors

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Given the advancements in modern living standards and technological development, conventional smart devices have proven inadequate in meeting the demands for a high-quality lifestyle. Therefore, a revolution is necessary to overcome this impasse and facilitate the emergence of flexible electronics. Specifically, there is a growing focus on health detection, necessitating advanced flexible preparation technology for biosensor-based smart wearable devices. Nowadays, numerous flexible products are available on the market, such as electronic devices with flexible connections, bendable LED light arrays, and flexible radio frequency electronic tags for storing information. The manufacturing process of these devices is relatively straightforward, and their integration is uncomplicated. However, their functionality remains limited. Further research is necessary for the development of more intricate applications, such as intelligent wearables and energy storage systems. Taking smart wear as an example, it is worth noting that the current mainstream products on the market primarily consist of bracelet-type health testing equipment. They exhibit limited flexibility and can only be worn on the wrist for measurement purposes, which greatly limits their application diversity. Flexible energy storage and flexible display also face the same problem, so there is still a lot of room for development in the field of flexible electronics manufacturing. In this review, we provide a brief overview of the developmental history of flexible devices, systematically summarizing representative preparation methods and typical applications, identifying challenges, proposing solutions, and offering prospects for future development.

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“…[196] However, in contrast, Xiao et al have reported that laser ablation can transform liquid metal from conductive to non-conductive states. [207] Finally, oxidation of the surface of galinstan affects its electrical conductivity because the resistivity of the oxide layer formed is higher than that of pure galinstan. To avoid or remove surface oxides, researchers have explored different methods, such as treating liquid metals with the hydrochloric acid solution, [193] developing a self-sinterable, gallium-based liquid metal ink containing hydrochloric acid to remove the oxide layer formed at the liquid metal interface, [208] peeling off spontaneously formed surface oxides using an elastomeric stamp, [111] or exploiting the genera-tion of liquid metal double-emulsion droplets to prevent surface oxidation.…”

Section: Galinstanmentioning

confidence: 99%

Current Status and Outlook of Low‐Melting‐Point Metals in Biomedical Applications

Mao,

Kim,

Seo

2023

Adv Funct Materials

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In recent years, low‐melting‐point metals including liquid metals, exhibiting outstanding physical and chemical properties such as excellent thermal and electrical conductivity, high surface tension, and biocompatibility, have garnered increasing attention from researchers. The melting point of such metals profoundly influences their properties and determines their range of applications, and comprehending the characteristics and properties of low‐melting‐point metals is crucial for their future applications. Although studies related to liquid metals are growing exponentially in particular, reports exploring the properties and applications of low‐melting‐point metals from the perspective of the melting point are still in their early stages. This review aims to comprehensively summarize the key properties and relevant applications of current low‐melting‐point metals described in recent studies, focusing on gallium‐ and bismuth‐based metal alloys. In addition, this review discusses the opportunities and challenges associated with low‐melting‐point metals, and it is anticipated that this review will contribute to the advancement of low‐melting‐point materials in the fields of flexible electronics and biomedicine, particularly for biomedical applications.

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Preparation of liquid metal circuits on flexible polymers by selective laser ablation: Essential mechanism of non-conductivity in ablation part

Cited by 11 publications

References 52 publications

Room‐Temperature Liquid Metals for Flexible Electronic Devices

Room‐Temperature Liquid Metals for Flexible Electronic Devices

A Review of Manufacturing Methods for Flexible Devices and Energy Storage Devices

Current Status and Outlook of Low‐Melting‐Point Metals in Biomedical Applications

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