Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering

Guo, Wei; Zhang, Hongqiang; Zhang, Xiaoying; Liu, Lei; Peng, Peng; Zou, Guisheng; Zhou, Y.

doi:10.1016/j.jallcom.2016.08.060

Cited by 45 publications

(20 citation statements)

References 29 publications

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“…As a key functional material of such electronic components, electronic paste has attracted extensive attention in its development and application fields [1][2][3][4][5]. At present, the most commonly used materials for the preparation of electronic pastes are conductive polymers [6,7], metal nanoparticles [8][9][10], carbon nanotubes, and graphene [11][12][13][14]. The overall performance, especially the conductive properties of carbon-based materials and conductive polymers materials, is much lower than that of metallic materials.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Nano Silver Paste and Applications in Transparent Electrodes via Electric-Field Driven Micro-Scale 3D Printing

Zhu

et al. 2020

Nanomaterials

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Nano-silver paste, as an important basic material for manufacturing thick film components, ultra-fine circuits, and transparent conductive films, has been widely used in various fields of electronics. Here, aiming at the shortcomings of the existing nano-silver paste in printing technology and the problem that the existing printing technology cannot achieve the printing of high viscosity, high solid content nano-silver paste, a nano-silver paste suitable for electric-field-driven (EFD) micro-scale 3D printing is developed. The result shows that there is no oxidation and settlement agglomeration of nano-silver paste with a storage time of over six months, which indicates that it has good dispersibility. We focus on the printing process parameters, sintering process, and electrical conductivity of nano-silver paste. The properties of the nano-silver paste were analyzed and the feasibility and practicability of the prepared nano-silver paste in EFD micro-scale 3D printing technology were verified. The experiment results indicate that the printed silver mesh which can act as transparent electrodes shows high conductivity (1.48 Ω/sq) and excellent transmittance (82.88%). The practical viability of the prepared nano-silver paste is successfully demonstrated with a deicing test. Additionally, the experimental results show that the prepared silver mesh has excellent heating properties, which can be used as transparent heaters.

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Section: Introductionmentioning

confidence: 99%

Preparation of Nano Silver Paste and Applications in Transparent Electrodes via Electric-Field Driven Micro-Scale 3D Printing

Zhu

et al. 2020

Nanomaterials

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“…There is also a strong dependence on the surface tension of the substrate. Dynamic ink-substrate interactions such as ink drop impact, wetting, spreading, penetration and solvent evaporation rate as well as drying and coalescence of the ink particles on the substrate, are all important factors (Allen et al, 2008;Guo et al, 2017;Nir et al, 2010;Kamyshny, 2011;Gamerith et al, 2007).…”

Section: Introductionmentioning

confidence: 99%

Dependence of electrical resistivity on sintering conditions of silver layers printed by InkJet printing technology

Lukács

Pietriková

Cabúk

2017

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Purpose The purpose of this paper is to find optimal sintering conditions of silver-based nano-inks for achieving the high electrical conductivity of the deposited layers applied on polyimide foils as well as the influence of ageing on the electrical conductivity. Therefore, the investigation in the field of silver layers deposited by inkjet printing technology is presented in this paper. Design/methodology/approach The four-point resistance measurements were realized for a detailed and precise analysis of the resistance of two different silver layers under different sintering conditions depending on the type of nano-ink varied about the recommended values. Highly accelerated stress tests (HASTs) were also applied as an ageing method for confirmation of the high electrical stability of the silver layers. Findings The results prove the strong influence of the temperature and the time of the sintering process on the sheet resistance of the investigated silver-based layers deposited by inkjet printing technology on polyimide foils. The HASTs caused significant changes in the electrical conductivity for both nano-inks presented in this paper. The existence of noticeable dependence among the resistivity, thermal treatment and ageing was proved. Originality/value The main benefit lays in the optimization of sintering conditions to improve the electrical conductivity of the silver layers. The paper also presents a new approach for a stability analysis of the silver layers by HASTs.

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“…The most mainstream soldering alloy is Au80Sn, with a eutectic melting point of 280 °C [ 2 ]. High costs constrain the rapid development of SiC devices [ 3 , 4 , 5 ].…”

Section: Introductionmentioning

confidence: 99%

A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

Wang

Zhang

et al. 2022

Materials

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A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this soldering material had a shear strength of over 40 MPa at 25 °C. This joint did not fail after more than 600 thermal cycles from −40 °C to 140 °C. The special feature of this joint is that the energy potential difference between nanoparticles and micron particles generated in the surface force field during reflow promoted the surface pre-melting of the particles by releasing the excess energy. By this mechanism, it was possible to reduce the porosity of the sintered layer. At the same time, due to the high surface activity energy of nano-silver, the diffusion of the Sn atoms was promoted, further enhancing the bond strength.

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Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering

Cited by 45 publications

References 29 publications

Preparation of Nano Silver Paste and Applications in Transparent Electrodes via Electric-Field Driven Micro-Scale 3D Printing

Preparation of Nano Silver Paste and Applications in Transparent Electrodes via Electric-Field Driven Micro-Scale 3D Printing

Dependence of electrical resistivity on sintering conditions of silver layers printed by InkJet printing technology

A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

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