Preparation of Ni paste using binary powder mixture for thick film electrodes

Im, D.H.; Hyun, Sang Hwan; Park, Sung-Yong; Lee, Byung-Yoon; Kim, Yoon-Hyun

doi:10.1016/j.matchemphys.2005.07.047

Cited by 29 publications

(14 citation statements)

References 9 publications

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“…Amongst the various conductive materials, copper has been established as an important choice because of high electrical conductivity, relatively higher melting point, excellent solderability, low electrochemical migration behavior and low materials cost (Wu et al, 2007;Wu, 2007a). The fired-on type base-metal-based pastes were successfully used in base-metal-electrode multi-layer ceramic capacitors (BME-MLCCs) as demonstrated (Im et al, 2006). In copper-based conductive paste, it is necessary to employ * Corresponding author.…”

Section: Introductionmentioning

confidence: 99%

Preparation of micron-sized flake copper powder for base-metal-electrode multi-layer ceramic capacitor

Gao

2009

Journal of Materials Processing Technology

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Section: Introductionmentioning

confidence: 99%

Preparation of micron-sized flake copper powder for base-metal-electrode multi-layer ceramic capacitor

Gao

2009

Journal of Materials Processing Technology

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“…9). However, for PP16 (22.5 m% of DBP) the viscosity η τ decreases in almost 4 times because of the lowest strength value and possible bimodal distribution of crystallites [75]. It was established that the investigated solutions demonstrate causal link between structural states formed.…”

Section: Fig 3 Strength Dependence Of Thixotropy Degree For Plasticimentioning

confidence: 94%

“…Therefore, terpineol [14][15][16][17][18][19][20][21] and its derivatives [17,20,[22][23][24][25][26][27][28][29] are used as a solvent, ethylcellulose as an organic binder [14,[15][16][17][18][19][20][21][30][31][32][33][34][35][36][37][38][39][40][41][42] because of their ability to form thixotropic systems with suspensions of particles of various origination [43]. However, there is almost no information about rheology of ethyl cellulose solutions in terpineol with the exception of [44].…”

Section: Introductionmentioning

confidence: 99%

Rheology of plasticized polymer solutions

Umerova¹,

Dulina²,

Ragulya³

2015

Epitoanyag - JSBCM

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this paper is about rheological properties of plasticized polymer solutions with different concentration of plasticizer. it was established that the investigated polymer solutions were threedimensionally structured systems which were shear thickened at low shear rates and maintained the thixotropic structural state under high shear rates. However, addition of different amount of plasticizer had an ambiguous influence on rheology of solutions and led to formation of transient polymer network with a complicated character of structuration because of the features of interaction in the polymer -plasticizer system. it was found that the plasticization results in changing of ec molecules conformation and simultaneous breaking of the polymer continuity due to DBP adsorption on ec macromolecule. Herewith, the formation of smaller crystallites took place. Besides, the investigated solutions showed causal link between structural states.

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Section: Introductionmentioning

confidence: 99%

“…Size of solid particles, particle size distribution, and powder ability to disperse in organic solvents determinate viscosity, rheological properties [ 1 , 2 ], and sedimentation stability of the paste in the first place. In the second place, they effect continuity [ 3 , 4 ] and roughness [ 2 ] of the electrode. Particularly, in paper [ 2 ] it was determinated that paste which contains powders with monomodal particle size distribution has the minimal viscosity and permits to obtain electrode layers with minimal roughness.…”

Section: Introductionmentioning

confidence: 99%

Obtaining of Ni/NiO nanopowder from aqua solutions of Ni(CH3COO)2 ammonia complexes

et al. 2015

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Ni/NiO nanopowders have been prepared by using thermal decomposition of aqua solutions of nickel acetate ammine complexes in air at the annealing temperature range of 300°C to 500°C, time of decomposition from 30 to 180 min, and ammonia content in initial complex 3.6 to 9.55 mol/mol Ni2+. Chemical composition of obtained powders has been characterized by chemical and thermal analysis. Phase analysis and particle size of powders have been investigated by X-ray diffraction method, transmission electron microscopy (TEM), and scanning electron microscopy (SEM). The powders’ pore structure has been determinated by low-temperature nitrogen adsorption method.Products of decomposition were represented as agglomerates of nanoparticles of Ni, NiO, and hydroxy-containing precursors. Mean agglomerate size depended on ammonia content in initial complex, annealing temperature, and duration and has grown from 30 to 40 to 400 to 520 nm. Mean nanoparticle size of hydroxy-containing precursors was invariable with ammonia concentration in initial complex, annealing temperature, and duration and has grown 5 nm. Mean nanoparticle size of Ni depended on annealing temperature and has grown from 40 to 60 to 40 to 70 nm at temperatures 400°С and 500°С, respectively. Mean nanoparticle size of NiO increased with temperature rising from 5 nm at 350°С to 20 to 25 nm at 500°С.

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Preparation of Ni paste using binary powder mixture for thick film electrodes

Cited by 29 publications

References 9 publications

Preparation of micron-sized flake copper powder for base-metal-electrode multi-layer ceramic capacitor

Preparation of micron-sized flake copper powder for base-metal-electrode multi-layer ceramic capacitor

Rheology of plasticized polymer solutions

Obtaining of Ni/NiO nanopowder from aqua solutions of Ni(CH3COO)2 ammonia complexes

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