2009
DOI: 10.1143/apex.2.075005
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Preparation of NiSi2Nanowires with Low Resistivity by Reaction Between Ni Coating and Silicon Nanowires

Abstract: Nickel silicide nanowires are promising interconnection and gate materials for one dimensional nanoelectronic devices. In this report, NiSi 2 nanowires with low resistivity of 23.5 cm were prepared by nickel sputtering on silicon nanowires and 550 C annealing. High resolution transmission microscopy, selective area electron diffraction and energy dispersive X-ray spectroscopy were used to characterize the structure and composition of NiSi 2 nanowires. Four-terminal electrical measurement was used to verify the… Show more

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Cited by 5 publications
(7 citation statements)
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“…Recently, various strategies have been developed for the growth of nickel silicide nanostructures involving about six stable nickel silicide phases, such as Ni 3 Si NWs [14], Ni 31 Si 12 NWs [15], Ni 2 Si NWs [11,16], Ni 3 Si 2 NWs [17], NiSi NWs [9,12,13], and NiSi 2 NWs [18], some of which have been successfully applied to nanoscale devices [19,20]. Generally, the method to synthesize different phases and morphologies of nickel silicides can be divided into two routes: delivery of Ni precursors to silicon and deposition of silicon sources on Ni film, both of which are based on the fundamental and crucial process of Ni-diffusion in silicon [9,12,13,21,22].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, various strategies have been developed for the growth of nickel silicide nanostructures involving about six stable nickel silicide phases, such as Ni 3 Si NWs [14], Ni 31 Si 12 NWs [15], Ni 2 Si NWs [11,16], Ni 3 Si 2 NWs [17], NiSi NWs [9,12,13], and NiSi 2 NWs [18], some of which have been successfully applied to nanoscale devices [19,20]. Generally, the method to synthesize different phases and morphologies of nickel silicides can be divided into two routes: delivery of Ni precursors to silicon and deposition of silicon sources on Ni film, both of which are based on the fundamental and crucial process of Ni-diffusion in silicon [9,12,13,21,22].…”
Section: Introductionmentioning
confidence: 99%
“…This finding also indicated a method for fabricating high quality NiSi 2 nanowires or NiSi 2 /Si nanowire junctions. Since the reaction temperature for the Si nanowires with thick oxide shells is high, the growth rate of NiSi 2 is much faster than that of the Ni silicide fabricated by the point-contact reaction (0.11 nm/s) as reported by Lu et al 5 In previous studies, 17,18 several methods for converting Si nanowires to NiSi 2 nanowires have been reported. Using arc ion implantation in vacuum, we have synthesized NiSi 2 /Si structure on Si nanowire surfaces.…”
Section: Resultsmentioning
confidence: 93%
“…However, it was difficult to improve the quality of these silicide nanowires by further annealing at a higher temperature because a too high annealing temperature caused change of the nanowire morphology. Zeng et al 17 reported a sputtering method to coat Si nanowires using the Ni ions with a relative low kinetic energy (about 18 eV). 19 They sug-gested that because of the damaging or implantation effect some Ni ions could be implanted into the nanowire surface region.…”
Section: Resultsmentioning
confidence: 99%
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“…9−12 Research on these materials is driven by their distinguished properties, such as high electrical conductivity 1,3,4,13 and superior thermal 14 and chemical stability. 14−16 Metallic silicides including TiSi 2 , 3,11 MnSi, 17 and NiSi 6,7,18 have been used as interconnects in electronic devices due to their low contact resistance. In addition, these materials are potential candidates for high-temperature applications as they usually have high melting points and show good oxidation resistance.…”
Section: ■ Introductionmentioning
confidence: 99%