Preparation of poly(amide-imide)s derived from biphenyltetracarboxylic dianhydrides

Shiotani, Akinori; Kohda, Masafumi

doi:10.1002/(sici)1097-4628(19970214)63:7<865::aid-app6>3.0.co;2-o

Cited by 14 publications

(4 citation statements)

References 3 publications

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“…A similar result was reported in the poly(amide-imide) homopolymers; however, the glass transition temperatures (T g 's) were not clearly observed for co-system. 28 The molecular weights of the polymers except XII were high enough to give tough and polyamides in the DSC charts (Table III). We have included the DMS measurements for the co-flexible films by the casting of polymer solutions.…”

Section: Introductionmentioning

confidence: 99%

Preparation of polyamides containingpara-linked dimethylbiphenylene moieties

Shiotani

Washio

1998

J. Appl. Polym. Sci.

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A series of wholly aromatic polyamides containing 3,3 -dimethylbiphenyl-4,4-dicarboxylic acid (P-DMBA) and 3,4 -dimethylbiphenyl-4,3 -dicarboxylic acid (Q-DMBA) was prepared by the direct polycondensation method using triphenylphosphite and pyridine. Most of the polymers are readily soluble in polar aprotic solvents such as N-methyl-2-pyrrolidone (NMP), N,N-dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), pyridine (py), and m-cresol and could be cast into tough and flexible films. The solubilities of copolyamides containing P-DMBA and Q-DMBA as acid components were remarkably improved. These were characterized by inherent viscosity, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and dynamic mechanical spectrometry (DMS) measurements. The glass transition temperatures of these polymers were in the range of 200-300ЊC and the 5% weight loss temperatures were 430-470ЊC. Films prepared by casting from polymer solutions exhibited good tensile properties.

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Section: Introductionmentioning

confidence: 99%

Preparation of polyamides containingpara-linked dimethylbiphenylene moieties

Shiotani

Washio

1998

J. Appl. Polym. Sci.

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“…Providing a favorable balance between processability and performance makes PAIs good choice for electrical devices, wire coating, adhesives, injection molding and extrusion products . Generally, PAIs can be synthesized by various methods including polycondensation reaction between: (i) trimellitic anhydride with diamines (DAs), (ii) monoimide dicarboxylic acids with DAs, (iii) diimide dicarboxylic acids with DAs, (iv) diimide DAs with dicarboxylic acids, (v) dianhydrides containing amide functions and diisocyanates, (vi) by the Pd catalyzed carbonylation of aromatic dihalides containing an imide backbone with DAs and (vii) diamide DAs with dianhydrides . As it can be concluded, the DAs are valuable building blocks for preparation of PAIs.…”

Section: Introductionmentioning

confidence: 99%

A new category of thermally stable poly(ether amide ether imide)s with increased solubility

Abbasi

Mehdipour‐Ataei

2013

Polymers for Advanced Techs

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Two new poly(ether amide ether imide)s (PEAEIs) were prepared from a new diamine (DA) containing ether, aliphatic, amide, naphthyl and pyridine functional groups that resulted flexible and thermally stable ultimate polymers. The DA was synthesized via two steps, starting from nucleophilic substitution reaction of 1,8-diamino-3,6-dioxaoctane with 6-chloronicotinoyl chloride in the presence of propylene oxide which, afforded dichloro-diamide (DCDA) compound. In the second step for the preparation of DA, reaction of DCDA compound with 5-amino-1-naphthol in the presence of K 2 CO 3 was achieved. The new DA was then polycondensed with 2,2'-bis-(3,4-dicarboxyphenyl) hexafluoropropane dianhydride and pyromellitic dianhydride to produce PEAEIs. The precursor, monomer and obtained polymers were entirely characterized by FT-IR and 1 H-NMR spectroscopy and elemental analysis techniques. The physical properties of the polymers including solubility, thermal behavior, thermal stability, inherent viscosity, morphology and mechanical properties were studied. The new PEAEIs exhibited favorable balance of physical and thermal properties, and their solubility was improved without sacrificing their thermal stability.

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“…Of late years, innovative applications for these polymers have been found in electrical wire enamel, adhesives, and injectionmolding and extrusion products [18][19][20]. The PAIs usually have been synthesized through the three chief methods.…”

Section: Introductionmentioning

confidence: 99%

Novel heat resistant nanostructure poly(amide–imide)s containing new TMA-based diacid via conventional polycondensation reaction in an ionic green medium: synthesis, morphology, and thermal properties

Mallakpour

Zeraatpisheh

2012

Designed Monomers and Polymers

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The 4,4′-Methylenebis(3-chloro-2,6-diethylaniline) has been reacted with two moles of trimellitic anhydride in refluxing N,N′-dimethylformamide to obtain 4,4′-Methylenebis(3-chloro-2,6-diethyl trimellitimidobenzene) for the first time. A series of novel poly(amide-imide)s (PAIs) was synthesized by the direct polycondensation of the synthesized diimidediacid with various commercial diamines. The direct polyamidation was performed under conventional heating reaction using tetra-n-butylammonium bromide and triphenyl phosphite as a condensing agent. The PAIs were obtained in good yields and moderate inherent viscosity up to 0.48 dL/g. Although the polymers were not soluble in low polar solvents tested, they were thoroughly dissolved in high polar solvents and even in a moderate polar solvent such as pyridine. The crystallinity of the prepared PAIs was measured by XRD scans. No remarkable crystal diffraction was detected for the polymers obtained, and they showed almost an amorphous diffraction patterns. The thermal behavior of the polymers was evaluated by thermogravimetric analysis (TGA) technique. This study showed obviously one-stage decomposition at elevated temperatures. On the basis of TGA data, such polymers are thermally stable and can be classified as self-extinguishing polymers. The structural features of these polymers were verified by elemental analysis, fourier transform infrared spectroscopy, and 1 H-NMR spectroscopies. The field emission scanning electron microscopy (FE-SEM) micrographs showed the obtained PAIs have nanostructure morphology. The effect of ultrasonic irradiation on the polymer morphology was studied. The FE-SEM micrographs illustrated that the morphology of macromolecules after ultrasonication became more homogenous than it is before ultrasonic radiation.

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Preparation of poly(amide-imide)s derived from biphenyltetracarboxylic dianhydrides

Cited by 14 publications

References 3 publications

Preparation of polyamides containingpara-linked dimethylbiphenylene moieties

Preparation of polyamides containingpara-linked dimethylbiphenylene moieties

A new category of thermally stable poly(ether amide ether imide)s with increased solubility

Novel heat resistant nanostructure poly(amide–imide)s containing new TMA-based diacid via conventional polycondensation reaction in an ionic green medium: synthesis, morphology, and thermal properties

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