Preparation of PVP coated Cu NPs and the application for low-temperature bonding

Yan, Jianfeng; Zou, Guisheng; Hu, Anming; Zhou, Yangping

doi:10.1039/c1jm12108a

Cited by 199 publications

(80 citation statements)

References 34 publications

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“…The synthesis of Cu NPs at low temperatures is realized only when additives that promote the reduction such as sodium hypophosphite monohydrate or sodium borohydride were added to the alcoholic system [29][30][31]. Increasing the reaction temperature near to the boiling point of ethylene glycol should enhance its reducing ability and facilitate the reduction of Cu 2+ ions within a short period of time.…”

Section: Effect Of Temperaturementioning

confidence: 99%

“…However, it should be noted that the above technique has not been successfully applied to large-scale synthesis of Cu NWs with dimensional properties suitable for conductive electrodes, that is, 20 nm in diameter and 20 μm in length [2,3]. One of the reasons could be the low redox potential of Cu ions compared to Ag ions, which requires the synthesis at elevated temperatures or the use of weak reducing agents such as either sodium hypophosphite or sodium borohydride along with alcohol that enhances the overall reducing ability of the system [29][30][31]. However, the products obtained were mostly Cu nanoparticles (NPs) and not Cu NWs.…”

Section: Introductionmentioning

confidence: 99%

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Large-Scale Cu Nanowire Synthesis by PVP-Ethylene Glycol Route

Huaman

Urushizaki

Jeyadevan

2018

Journal of Nanomaterials

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Cu nanowire (NW) is a promising cost-benefit conducting material that could be considered for the development of transparent conducting films (TCF). However, the development of Cu NW as an alternating material for Ag or Au is not only limited by its stability in atmospheric conditions in the nanometer range but also due to the nonavailability of a simple synthetic route to produce them in high yields and in large-scale. Here, a scheme to synthesize Cu NWs by reducing Cu nitrate in a Cl − ionpolyvinylpyrrolidine-(PVP-) ethylene glycol (EG) system is proposed. Cu NWs with average diameter around 60 nm and average length of about 40 μm was obtained under optimized experimental conditions. Furthermore, the formation of Cu NW was elucidated to be through the progression of the following sequential reduction steps: at first, Cu ions underwent partial reduction to form spherical Cu 2 O. Then, the spherical Cu 2 O particles were redissolved and reduced to metallic Cu 0 atoms that subsequently formed the Cu seeds. Thereafter, Cu seeds underwent etching to form multiply-twinned particles (MTP). Finally, these Cu MTP grew unidirectionally to form metallic Cu NWs.

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Section: Effect Of Temperaturementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Large-Scale Cu Nanowire Synthesis by PVP-Ethylene Glycol Route

Huaman

Urushizaki

Jeyadevan

2018

Journal of Nanomaterials

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“…3(b)(d). The sintering between Ag nanowire/nanoplate at room temperature is probable because the thickness of Ag nanoplates is 520 nm, which is only ³10%20% of the Ag nanoparticles reported in Peng et al 14,19) This dimensional decrease enhances the Ag atom diffusion between Ag nanoplate edges and Ag nanowire sides and further enables sintering. The sintered Ag nanoplates and nanoplates lead to the neck growth and direct metallic bonding.…”

Section: Resultsmentioning

confidence: 99%

“…The bonding strength of Ag NPL/NW approximately stabilized at around 16.5 MPa at 100°C without a processing pressure, which is significant stronger than those in reported results investigating bonding with other paste materials such as Cu nanoparticles (<1 MPa) or Ag nanoparticles (2³4 MPa) processed with 5 MPa pressure. 9,14,28) The increase of bonding strength associated with the decrease of resistivity reveals the effect of sintering to this high bonding strength. The dashed line in Fig.…”

Section: Resultsmentioning

confidence: 99%

Ag Nanowire and Nanoplate Composite Paste for Low Temperature Bonding

Zhang

et al. 2015

Mater. Trans.

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Nanopastes based on noble metals for low temperature bonding are currently of great interest. We have developed Ag nanowire and nanoplate composite paste. Copper-copper joining has been achieved using solid state sintering of nanopastes. We show that an enhanced bonding strength can be achieved by integrating Ag nanoplates into Ag nanowire pastes. Ag nanowire and nanoplate composite pastes are capable of being a low-temperature interconnect material potentially for interconnection in lead-free microcircuits, flexible electronic packaging and sensing applications.

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“…13,14) The Cu nanoparticles was prepared in ambient atmosphere based on the polyol method. 8) Cu+Ag mixed nanoparticles with different molar fractions (Cu/Ag molar ratio: Cu, Cu4/Ag1, Cu1Ag1, Cu1Ag4 and Ag) were prepared by mechanical mixing of Cu nanoparticles and Ag nanoparticles.…”

Section: Methodsmentioning

confidence: 99%

Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles

et al. 2013

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The Cu+Ag mixed nanoparticles were prepared based on the chemical reduction method. The polymer coated on the Cu+Ag mixed nanoparticles can protect Cu nanoparticles from oxidation. The metalmetal joint of silver plated Cu bulks was investigated with the use of Cu+Ag mixed nanoparticles. The bonding experiments show that joint with shear strength about 20 MPa was formed at the bonding temperature above 250°C under 5 MPa using Cu+Ag mixed nanoparticles. The strength of bonding using Cu+Ag mixed nanoparticles is lower than that of bonding using pure Ag nanoparticles. This may be due to the fact that the sintering between the Cu nanoparticles and Ag nanoparticles is more difficult than the sintering between Ag nanoparticles.

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Preparation of PVP coated Cu NPs and the application for low-temperature bonding

Cited by 199 publications

References 34 publications

Large-Scale Cu Nanowire Synthesis by PVP-Ethylene Glycol Route

Large-Scale Cu Nanowire Synthesis by PVP-Ethylene Glycol Route

Ag Nanowire and Nanoplate Composite Paste for Low Temperature Bonding

Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles

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Preparation of PVP coated Cu NPs and the application for low-temperature bonding

Cited by 199 publications

References 34 publications

Large-Scale Cu Nanowire Synthesis by PVP-Ethylene Glycol Route

Large-Scale Cu Nanowire Synthesis by PVP-Ethylene Glycol Route

Ag Nanowire and Nanoplate Composite Paste for Low Temperature Bonding

Metal&ndash;Metal Bonding Process Using Cu+Ag Mixed Nanoparticles

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Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles