Present and Future of Build-up PWB's-Their Possibility and Limitation. Liquid Type Intermediate Dielectric Material for Build-up Process.

Takehara, Eiji

doi:10.5104/jiep.2.446

Journal of Japan Institute of Electronics Packaging

1999

DOI: 10.5104/jiep.2.446

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Present and Future of Build-up PWB's-Their Possibility and Limitation. Liquid Type Intermediate Dielectric Material for Build-up Process.

Eiji Takehara

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Present and Future of Build-up PWB's-Their Possibility and Limitation. Liquid Type Intermediate Dielectric Material for Build-up Process.

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