Press and Die Deformation for a Precise Semiconductor Lead Frame

Abstract

The metal lead frame, a semiconductor component, has product tolerances in micro units as compared to products made with a larger size mold. Therefore, small deflections of the mold and of the press as well as the press molding process itself have a strong influence on accuracy of the product. Hence, it is necessary for the process design to consider the structural response of the mold and the press during deformation. In the current study, the mold deflection and pressure on the punch is examined using the finite element modeling (FEM) program ABAQUS. The results from the simulation were verified with the dynamic deformation measurement equipment using digital image correlation (DIC).