Pressure sensors for printed blast dosimeters

Daniel, Jürgen; Ng, Tse Nga; Coleman, John K.M.; Liu, Jianzhong; Jackson, Ronald L.

doi:10.1109/icsens.2010.5690713

Cited by 6 publications

(4 citation statements)

References 8 publications

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“…The most traditional method used clinically is the Glasgow Coma Scale (GCS) based on verbal, eye and motion responses which is often augmented with computer tomography imaging in moderate to severe cases (Svetlov et al, 2010;Hergenroeder et al, 2008). Current devices to monitor head trauma include piezoelectric or acceleration sensors that line a helmet for military or contact sport use (Daniel et al, 2010;Greenwald et al, 2008). Other non-commercial devices are biosensors which measure TBI biomarkers in cerebral spinal fluid or blood (Svetlov et al, 2010).…”

mentioning

confidence: 99%

Development of electrochemical methods to enzymatically detect traumatic brain injury biomarkers

Haselwood

Belle

2015

Biosensors and Bioelectronics

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As awareness of traumatic brain injury (TBI) increases, the need to detect mild forms and distinguish between the different severities of TBI becomes more apparent. The goal of this work is to develop a point-of-care sensor to detect whole blood biomarkers for rapid and sensitive diagnosis of TBI severity. Presented herein is the enzymatic detection of norepinephrine through the use of immobilization chemistry and impedance techniques. Sustained elevation of norepinephrine concentrations in the blood has been correlated to negative long-term outcomes in TBI cases, often resulting in permanent cognitive or physical deficits.Novel analysis techniques have been used to identify an optimal binding frequency (371.1 Hz) of norepinephrine to the immobilized enzyme on a gold disk electrode. This form of analysis yielded a logarithmic fit characterized by exceptional responsivity (20.89 ohms/pgmL -1 ), reproducibility (R 2 = 0.96), and lower limit of detection (98 pg/mL) first in purified samples, then in rabbit whole blood solutions. Once the optimal binding frequency was determined, the preliminary use of an impedance-time technique was attempted in this work. This technique more closely resembles the amperometric detection method used in commercial self-monitoring blood glucose meters, allowing for continuous or instantaneous measurement of blood borne biomarkers without compromising sensitivity. Future directions include exploration of simultaneous multi-marker detection with the impedance-time technique and experimentation with novel mesoporous materials to filter large blood components.

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confidence: 99%

Development of electrochemical methods to enzymatically detect traumatic brain injury biomarkers

Haselwood

Belle

2015

Biosensors and Bioelectronics

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“…The process of lamination involves the application of a thin sheet of material to a structure using various bonding methods including adhesives, welding, heat or pressure. The common sheet materials include metal foils and dielectric polymer sheets [3], [128]. The sheet material is usually added to the surface of a 3D printed substrate to form an even surface for further processing or to provide a conductive layer that can be further processed.…”

Section: ) Laminationmentioning

confidence: 99%

A Survey of 3D Printing Technologies as Applied to Printed Electronics

Persad

Rocke

2022

IEEE Access

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3D printing technologies (3DP) leverage the benefits of additive manufacturing across many areas including electronics, food, medicine and optics. These technologies allow varying materials to be precision deposited, forming structures ranging from simple to complex composites such as organs and satellites. One important application for 3DP is printed electronics which is expected to exceed USD10 billion in market value by 2030. However, while considerable work has been reported in areas including inter alia: mechanical, thermal and multiple aspects, there has been less emphasis on the critical electromagnetic (EM) domain. In the EM domain, related work for 3DP encompasses interrelated EM studies of materials, processes and built structures and examines material characteristics including permittivity, permeability, electrical conductivity, which are foundational to 3D printed electronics design and fabrication. This paper presents a comprehensive report of 3DP technologies as applied to EM research & development (R&D) and end applications in order to inspire exploratory work in related areas by providing sufficient breadth for newcomers and depth for experts. The paper contributions include: summarization of the major R&D and applications areas for 3DP, thereby quantifying the prevalence of EM related work; examination of mainstream 3DP technologies applied to EM related R&D and end applications based on their materials, technology highlights and known issues; examination of relevant research which incorporates traditional printing, proprietary methods and composite 3DP methods; and classification of 3DP built EM structures as reported by research teams. Finally, the key challenges and opportunities for future research are identified and discussed.

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“…The blast dosimeter was a DARPA project to create an inexpensive flexible electronic patch on a soldier's helmet that recorded the exposure to explosive blasts, to monitor for possible brain trauma [21], [22]. The project proved to be a valuable testbed for developing printed electronics beyond TFT backplanes.…”

Section: A Blast Dosimetermentioning

confidence: 99%

“…9 shows a schematic of how these sensors are incorporated into the printed patch. The sensors are formed as a PVDF-trFE film over a cavity in various configurations, made by printing the cavity, laminating the PVDF-trFE film, and printing the electrical contacts and proof mass [21]. The pressure sensor is formed from a sealed cavity, while the compressive-mode accelerometer is the same structure with a proof mass, and a temperature sensor can be designed as a bimorph of PVDF-trFE and a film with a different thermal expansion coefficient.…”

Section: A Blast Dosimetermentioning

confidence: 99%

From Printed Transistors to Printed Smart Systems

Street

Schwartz

et al. 2015

Proc. IEEE

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Printing as a manufacturing technique is a promising approach to fabricate low-cost, flexible and large area electronics. Higher performance can be achieved with printed hybrid electronics.ABSTRACT | Printing as a manufacturing technique is a promising approach to fabricate low-cost, flexible, and large area electronics. Over the last two decades, a wide range of applications has been explored, among them displays, sensors, and printed radio-frequency identification devices. Some of these turned out to be challenging to commercialize due to the required infrastructure investment, accuracy or performance expectations compared to incumbent technologies. However, the progress in terms of material science, device, and process technology now makes it possible to target some realistic applications such as printed sensor labels. The journey leading to this exciting opportunity has been complex. This review describes the experience and current efforts in developing the technology at PARC, a Xerox Company. Printed smart labels open up low-cost solutions for tracking and sensing applications that require high volumes and/or would benefit from disposability. Examples include radiation tags, one-time use medical sensors, tracking the temperature of pharmaceuticals at the item level, and monitoring food sources for spoilage and contamination. Higher performance can be achieved with printed hybrid electronics, integrating microchip-based signal processing, wireless communication, sensing, multiplexing, as well as ancillary passive elements for low-profile microelectronic devices, opening up further applications. This technology offers custom circuitry for demanding applications and is complementary to mass printed transistor circuits. As an example, we describe a prototype sense-and-transmit system, focusing particularly on issues of integration, such as imped-ance matching between the sensor and circuits, robust printed interconnection of the chips, and compatible interface electronics between printed and discrete parts. Next-generation technologies will enable printing of entire smart systems using microchip inks. A new printing concept for the directed assembly of silicon microchips into functional circuits is described.The process is scalable and has the potential to enable additive, digital manufacturing of high-performance electronic systems.

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Pressure sensors for printed blast dosimeters

Cited by 6 publications

References 8 publications

Development of electrochemical methods to enzymatically detect traumatic brain injury biomarkers

Development of electrochemical methods to enzymatically detect traumatic brain injury biomarkers

A Survey of 3D Printing Technologies as Applied to Printed Electronics

From Printed Transistors to Printed Smart Systems

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