Pressureless sintering of boron carbide ceramics

Kumazawa, Takeshi; Honda, Toru; Zhou, You; Miyazaki, Hiroyuki; Hyuga, Hideki; Yoshizawa, Yu‐ichi

doi:10.2109/jcersj2.116.1319

Cited by 22 publications

(21 citation statements)

References 12 publications

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“…In this study, B 4 C ceramics for use in high-temperature applications were joined using foils of refractory metals such as Ti and Mo. He investigated the joining of B 4 C ceramics at 1500°C over a period of 10 h under a pressure of 18.6 MPa using various foils.…”

Section: Cockerammentioning

confidence: 99%

“…It is well known that Al has a low melting point, which is 660°C, and that it is an effective sintering additive for the preparation of B 4 C ceramics. 4)6) Kumazawa et al 4) reported that B 4 C compacts were pressurelessly sintered using Al gas and a Si compound gas derived from SiC. Miyazaki et al 5) studied the microstructure of B 4 C ceramics pressurelessly sintered in an Ar atmosphere containing Al gas and a Si-compound gas.…”

Section: Cockerammentioning

confidence: 99%

“…Therefore, they are suitable for the manufacture of such stages and tables. In addition, it is expected that larger-sized B 4 C ceramics will be required as the size of Si wafers used commercially increases from 12 to 16 in. The joining of B 4 C ceramics is considered to be one of the more promising and effective approaches for producing large-sized B 4 C components for such applications.…”

Section: Introductionmentioning

confidence: 99%

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Influence of joining time and temperature on the flexural strength of joined boron carbide ceramics

Sekine¹,

Kumazawa

Tian³

et al. 2012

J. Ceram. Soc. Japan

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The influence of the joining time and temperature on the flexural strength of B 4 C ceramics joined using an Al sheet was investigated. The B 4 C ceramics were joined over a temperature range 6001400°C for 272 h in vacuum (10 ¹2 10 ¹4 Pa) and in an Ar atmosphere. A joining interlayer with a dense structure was found in the B 4 C joint formed at 1000°C after 2 h in vacuum, and mainly Al was present in this joining interlayer. On the other hand, some voids existed in the joining interlayer in the B 4 C joint formed after 72 h. In addition, Al was not present in this interlayer owing to its reaction with B 4 C as well as the evaporation of Al. Four-point bending tests of the B 4 C joints formed at 1000°C in vacuum for periods ranging from 2 to 72 h were performed at room temperature. The average four-point bending strengths of the B 4 C joints formed after 2 h at 7001100°C were close to that of the B 4 C base material, and the B 4 C ceramics were considered to have successfully bonded. However, the joint strength decreased with an increase in the joining time, and the B 4 C ceramics did not bond at temperatures over 1200°C in vacuum. On the other hand, the B 4 C ceramics did bond at 12001400°C in Ar.

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Section: Cockerammentioning

confidence: 99%

Section: Cockerammentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Influence of joining time and temperature on the flexural strength of joined boron carbide ceramics

Sekine¹,

Kumazawa

Tian³

et al. 2012

J. Ceram. Soc. Japan

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“…2) Nowadays, large-sized B 4 C ceramics are required for stages and table of steppers, which are one of the semiconductor manufacturing equipments. Steppers are an essential part of the semiconductor manufacturing process, called photolithography, which creates millions of microscopic circuit elements on the surface of tiny chips of Si.…”

Section: Introductionmentioning

confidence: 99%

“…However, this method is not suitable for manufacturing large-sized and complicated components from the viewpoint of energy saving and production efficiency. Joining of B 4 C ceramics is considered as one of the promising and effective approaches for producing B 4 C components for such applications.…”

Section: Introductionmentioning

confidence: 99%

Low-temperature joining of boron carbide ceramics

Sekine¹,

Kumazawa²,

Tian³

et al. 2012

J. Ceram. Soc. Japan

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Low-temperature joining of boron carbide (B 4 C) ceramics using an Al sheet was investigated in the temperature range of 600 1200°C for 2 h in vacuum (10 ¹2 10 ¹4 Pa). Successful joining and high bending strength close to that of the B 4 C base were achieved in the samples joined at 7001100°C. Different techniques including scanning electron microscopy (SEM), electron probe microanalysis (EPMA) and transmission electron microscopy (TEM) were used to characterize the high-strength B 4 C joints. SEM observations suggested the dense interlayer and the crack-free interface as well as the penetration of Al into the surface microcracks of B 4 C base. Further TEM examinations revealed that B 4 C and Al joined directly. EPMA analysis demonstrated the existence of several reaction products within interlayer, including AlB 2 and Al 3 BC, which resulted in the development of high-strength composite interlayer.

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