Prevention of hillock formation during micro-machining of silicon by using OTS-SAM and SiO 2 coatings

Oh, Tong In; Kim, H. J.; Kim, D. E.

doi:10.1016/j.cirp.2010.03.084

Cited by 5 publications

(3 citation statements)

References 21 publications

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“…Photolithography is a typical nanofabrication approach with high-throughput in mass production, but its fabrication process is costly and tends to be limited in resolution 5 . In addition, photolithography is not suitable for flexible fabrication of micro-mold and prototype fabrication of microsystems 6 . Nanoimprint lithography is an effective approach for patterning nanostructures with high resolution 7 .…”

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confidence: 99%

Nondestructive nanofabrication on Si(100) surface by tribochemistry-induced selective etching

Guo

Chen

et al. 2015

Sci Rep

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A tribochemistry-induced selective etching approach is proposed for the first time to produce silicon nanostructures without lattice damage. With a ~1 nm thick SiOx film as etching mask grown on Si(100) surface (Si(100)/SiOx) by wet-oxidation technique, nano-trenches can be produced through the removal of local SiOx mask by a SiO2 tip in humid air and the post-etching of the exposed Si in potassium hydroxide (KOH) solution. The material removal of SiOx mask and Si under low load is dominated by the tribochemical reaction at the interface between SiO2 tip and Si/SiOx sample, where the contact pressure is much lower than the critical pressure for initial yield of Si. High resolution transmission electron microscope (HRTEM) observation indicates that neither the material removal induced by tribochemical reaction nor the wet etching in KOH solution leads to lattice damage of the fabricated nanostructures. The proposed approach points out a new route in nondestructive nanofabrication.

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confidence: 99%

Nondestructive nanofabrication on Si(100) surface by tribochemistry-induced selective etching

Guo

Chen

et al. 2015

Sci Rep

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“…Over the past few decades, numerous techniques to fabricate micro/nano-scale patterns have been developed in order to attain various surface morphologies [8,9]. For example, scanning probe lithography, nano-imprinting, photolithography, RIE (reactive-ion etching), and LIGA (Lithographie, Galvanoformung, Abformung) techniques have been successfully utilized as surface patterning processes [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Development of highly durable and low friction micro-structured PDMS coating based on bio-inspired surface design

Ryu

Kim

2015

CIRP Annals

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“…As a typical nanofabrication method on silicon, photolithography technique involves complex systems and multiple steps [ 6 , 7 ]. Although it has a huge merit in mass production, photolithography is not suitable for flexible fabrication of micro-mold and prototype fabrication of microsystems [ 8 ]. Therefore, it remains essential to develop a simple and flexible nanofabrication technique to meet the requirements of nanoscience and nanotechnology.…”

Section: Introductionmentioning

confidence: 99%

Nanofabrication on monocrystalline silicon through friction-induced selective etching of Si3N4 mask

Guo

Wang

et al. 2014

Nanoscale Res Lett

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A new fabrication method is proposed to produce nanostructures on monocrystalline silicon based on the friction-induced selective etching of its Si3N4 mask. With low-pressure chemical vapor deposition (LPCVD) Si3N4 film as etching mask on Si(100) surface, the fabrication can be realized by nanoscratching on the Si3N4 mask and post-etching in hydrofluoric acid (HF) and potassium hydroxide (KOH) solution in sequence. Scanning Auger nanoprobe analysis indicated that the HF solution could selectively etch the scratched Si3N4 mask and then provide the gap for post-etching of silicon substrate in KOH solution. Experimental results suggested that the fabrication depth increased with the increase of the scratching load or KOH etching period. Because of the excellent masking ability of the Si3N4 film, the maximum fabrication depth of nanostructure on silicon can reach several microns. Compared to the traditional friction-induced selective etching technique, the present method can fabricate structures with lesser damage and deeper depths. Since the proposed method has been demonstrated to be a less destructive and flexible way to fabricate a large-area texture structure, it will provide new opportunities for Si-based nanofabrication.

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Prevention of hillock formation during micro-machining of silicon by using OTS-SAM and SiO 2 coatings

Cited by 5 publications

References 21 publications

Nondestructive nanofabrication on Si(100) surface by tribochemistry-induced selective etching

Nondestructive nanofabrication on Si(100) surface by tribochemistry-induced selective etching

Development of highly durable and low friction micro-structured PDMS coating based on bio-inspired surface design

Nanofabrication on monocrystalline silicon through friction-induced selective etching of Si3N4 mask

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