Principle, General Features and Scope of the Reaction, Recent Advances, Future Prospects

Autocatalytic Deposition of Nickel–Boron Diffusion Barrier onto Diazonium-Treated SiO2 for High Aspect Ratio Through-Silicon Via Technology in 3D Integration

“…Since its inception by J. Pinson and colleagues, the diazonium grafting technique has emerged as a powerful tool, facilitating the direct electrografting of vinylic polymers onto silicon semiconductors . Our present work introduces a novel approach for diazonium grafting onto SiO 2 dielectric surfaces while also exploring its application in the domain of deep through-silicon vias.…”

“…This process which has been proven to be efficient for various microstructures (5 μm × 3 μm cavity and low-aspect ratio structures) enables for easy electroless plating of a nickel− boron film. 13,14 Since its inception by J. Pinson and colleagues, 15 the diazonium grafting technique has emerged as a powerful tool, facilitating the direct electrografting of vinylic polymers onto silicon semiconductors. 16 Our present work introduces a novel approach for diazonium grafting onto SiO 2 dielectric surfaces while also exploring its application in the domain of deep through-silicon vias.…”