Principles of Electronic Packaging

Abstract

This is a valuable book giving a good overview as well as a state-of-the-art account of several topics related to thermal aspects of electronic packaging. Chapter I, by Nakayama, is entitled: "Thermal Management of Electronic Equipment: A Review of Technology and Research Topics." The role of heat transfer engineering and fundamental research, toward establishing design criteria are discussed. An exposition of natural convection, forced convection and advanced schemes of cooling follows. An interesting account of the heat load in Japanese computers caps up the section. Yovanovich and Antonetti wrote the next Section on the application of thermal contact resistance theory to electronic packages. The study surveys mechanical joints and the role of surface roughness, crucial, for example, to the performance of various electrical connectors. Direct air cooling of electronic components is discussed by Moffat and Ortega under two major headings, 1. Forced Convection and II. Natural Convection. Analytical and numerical methods, and experimental data are presented in the first part.

Characterization of the microstructure and phase formation in the Au–In system using transmission electron microscopy

“…A close examination of the diffraction pattern in Fig. 5(b) also reveals that the (2 2 0) 2 and Au, in which AuIn 2 has CaF 2 type face-centered cubic structure. A schematic of the diffraction pattern illustrating the major reflections is given in Fig.…”

“…On one hand, thin films are the key technology in many sectors of hi-tech industry, e.g. in the manufacturing of microelectronics components and solid state devices [1,2], on the other hand, they often show properties that differ from the bulk [3,4], e.g. the solubility of an impurity in a thin film is usually much higher than that in the bulk.…”

Ultrafast photodetectors and receiver

“…The reduced value of the photocurrent with respect to the ideal one in the stationary case will be diminished further in the high frequency range of operation due to further bandwidth limiting effects, like the RC-limit and the transit time limitation, to be discussed in the following sections. For a compilation of general, instructive references to detectors and receivers and their system applications, see, e.g., [49][50][51][52][53][54][55][56][57][58][59][60][61].…”

Molten Lead-Free Solder Deposited by Inkjet Printing for Bonding of Thin-Film Solar Cell Modules

“…Among the various solutions for cheaper fabrication is the utilization of new materials or approaches in solder connection technology, including the use of high performance electronic products such as flip-chip binding, 11) ball grid arrays, 12) and photovoltaic (PV) module encapsulation, 13) which can help address this issue of electrical power loss due to poor bonding strength. However, the production cost of PV module encapsulation in solder connections is still too high when using silver paste as the electrical interconnects between solar cells and copper strips.…”