Principles of PD Recording Systems and their Use in Photofabrication

Jonker, H.; Beek, L. K. H. van; Dippel, C. J.; Janssen, Ch.; Molenaar, A A A; Spiertz, E. J.

doi:10.1080/00223638.1971.11737589

Cited by 19 publications

(20 citation statements)

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“…Au-NPs can catalyze the electroless copper deposition and induce CuSO 4 reduction to Cu by HCHO [31][32][33][34]. In order to verify that the macroporous Au has the same behavior as the Au-NPs, the experiment of the electroless copper deposition is carried out using macroporous Au as catalyst.…”

Section: Resultsmentioning

confidence: 99%

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Macroporous Au materials prepared from colloidal crystals as templates

Cong

Cao

2004

Journal of Colloid and Interface Science

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Section: Resultsmentioning

confidence: 99%

“…The macroporous Au fabricated on the silicon wafer was immerged into the mixture of 15 ml of CuSO 4 (20 mg ml −1 ) and 15 ml of HCHO (100 mg ml −1 , pH ∼ 12.5) at ∼25 • C for 3 h to reduce the Cu 2+ into Cu on the surface of Au, which played the role of a catalyst [31][32][33][34].…”

Section: Electroless Deposition Of Copper Into Macroporous Aumentioning

confidence: 99%

Macroporous Au materials prepared from colloidal crystals as templates

Cong

Cao

2004

Journal of Colloid and Interface Science

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“…[21][22][23][24] In the present study an Au-NP film pattern on Si substrate was immersed in a Cu electroless deposition liquid. After electroless deposition for 3 min at 25 8C, a Cu film pattern was obtained, as shown in Figure 4.…”

Section: Au-np and Cu Film Patternmentioning

confidence: 99%

Selective Electroless Deposition of Cu on an Ultrathin Au Film Pattern

Zhang

Cong

et al. 2004

Macromol. Rapid Commun.

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Summary: In this report an ultrathin Au nanoparticle (AuNP) film composed of photosensitive diazoresin (DR) and mercaptophenol (MP) capped AuNPs (MP‐AuNPs) was fabricated by self‐assembly (SA). The DR/MP‐AuNP film was then patterned through a photomask by selective exposure to UV light and instantly developed in sodium dodecyl sulfate (SDS) aqueous solution. After sintering at 550 °C to remove the organic components, the DR/MP‐AuNPs formed AuNPs. Taking advantage of the catalytic susceptibility of AuNPs toward electroless deposition of Cu, a Cu film micropattern with fine resolution (ca. 2–3 μm) and considerable thickness (ca. 130 nm) was prepared.SEM image of the micropatterned Cu film on a silicon substrate; scale bar: 10 μm.magnified imageSEM image of the micropatterned Cu film on a silicon substrate; scale bar: 10 μm.

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“…In the SEM microphotographs, shown in Figs. 9-12, the exposed T4 emulsion has been fixed after removing the gelatin and subsequently treated with the physical developer FC 3 -a so-called surfactant stabilized developer -according to Jonker et al (1971). Figs.…”

Section: Co Expemnents On Pnvsrcat Ueveronmentmentioning

confidence: 99%