1987
DOI: 10.1016/0257-8972(87)90174-5
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Principles of plasma-activated chemical vapour deposition

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Cited by 21 publications
(4 citation statements)
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“…With the used frequency the argon and hydrogen ions can follow the temporal variations in applied potential [5,6]. The character of such a discharge raises basic questions about what occurs in the discharge; the gas temperature is generally assumed to be in the range 1000-2000 K [7].…”
Section: Methodsmentioning
confidence: 99%
“…With the used frequency the argon and hydrogen ions can follow the temporal variations in applied potential [5,6]. The character of such a discharge raises basic questions about what occurs in the discharge; the gas temperature is generally assumed to be in the range 1000-2000 K [7].…”
Section: Methodsmentioning
confidence: 99%
“…In the present study, Plasma Enhanced Chemical Vapour Deposition (PECVD) technique is chosen to overcome the thermal restrictions. The plasma activation has the advantage of reducing the deposition temperature from a range of 600-700˚C to 400˚C or even less [22]. In addition, this deposition technique has other benefits such as processing compatibility, which makes it possible to use the same method for the deposition of the gate dielectric as well as the active layers, minimising the process steps.…”
Section: Introductionmentioning
confidence: 99%
“…Chlorosilanes are used extensively in semiconductor industry, , and the fragment cations of chlorosilanes are found in the processes of plasma-enhanced chemical vapor deposition and chlorine-based plasma etching, in which silicon monochloride cation (SiCl + ) is a crucial reactive intermediate. For example, during the silicon-etching process in chlorine-based plasmas, SiCl + plays a significant role in the deposition of silicon on the reactor wall, and can be neutralized and returned into the plasma.…”
Section: Introductionmentioning
confidence: 99%