Printed circuit board embedded power semiconductors: A technology review

Huesgen, Till

doi:10.1016/j.pedc.2022.100017

Cited by 16 publications

(2 citation statements)

References 55 publications

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“…Focusing on the Weibull parameters, the data can indeed be represented as a two-parameter Weibull distribution (linear fitting) and the high beta values show a narrow distribution of results, with an alpha value above 68 kV/mm (evaluated on 28 data points). This is comparable with the expected values for neat epoxy resin typically used in PCB manufacturing (about 50 kV/mm) [1].…”

Section: Figure 3 Weibull Plot Of the Vitrimer Breakdown Strength Sho...supporting

confidence: 89%

“…Power electronic modules based on Printed Circuit Board (PCB) with embedded active and passive components are solutions that can answer the requirements of higher integrability and efficiency, more effective cooling and simpler manufacturing, compared to the state-of-the art classical power modules based on DBC (Direct Bond Copper) substrates. [1]- [3] To satisfy the requirements of PCB-embedded architectures, the dielectric surrounding the chip is now accountable for several new functions on top of its electrical insulation and environmental protection roles. It is now required to provide mechanical support to the module, acting as the main substrate, but also to play an active part in heat dissipation through the package, which was previously handled by the DBC's dielectric.…”

Section: Introductionmentioning

confidence: 99%

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New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications

Arati,

Bley,

Pichon

et al. 2023

IEEE Access

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Printed Circuit Board (PCB)-embedded power electronics packages are anticipated as the next major packaging trend to support efficient and reliable electrical energy conversions. With many core aspects of the package being modified, the dielectric is now required to ensure new functions while still assuming its original electrical insulation function. With the expected increase of operational voltages that come with wide bandgap semiconductor components, high-reliability dielectric packaging materials are required. Given the recent breakthrough in polymeric science, self-healing materials based on Covalent Adaptable Networks (CANs) can be applied to highly stressed systems such as integrated power modules, with the aim to improve the reliability of the package. This work proposes a critical evaluation of the compatibility of a CAN to the requirements of the power electronics field and evaluates the recovery efficiency through mechanical and electrical indicators.

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Section: Figure 3 Weibull Plot Of the Vitrimer Breakdown Strength Sho...supporting

confidence: 89%

Section: Introductionmentioning

confidence: 99%

New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications

Arati,

Bley,

Pichon

et al. 2023

IEEE Access

View full text Add to dashboard Cite

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Effect of Interface Bonding on Optimizing the Heat Transfer in Substrate Board With an Array of Heat Sources

Varma,

Nelson,

Venkateshan

2024

Heat Trans

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Effective heat distribution in electronic circuitry is essential to improve the performance and life of electronic components such as chips. This study presents a numerical analysis of heat transfer on a substrate board populated with an array of discrete heat sources, assumed to be placed in a horizontal air channel for forced convection cooling. The analysis of electronic packages is performed, taking into consideration the effect of thermal contact conductance (TCC) between the heat source (chip) and the substrate board. The dependence of the temperature distribution on the Reynolds number of air at the inlet and the heating power from the heat source is investigated for inlet velocities ranging from 0.6 to 1.4 m/s and observed to be significant. Temperature and heat transfer coefficient are observed to systematically increase with the increase in the heat dissipation from the heat source. Two configurations—inline and staggered—are analyzed, with the staggered configuration showing superior cooling performance. This improvement is attributed to the fact that staggered arrangements expose fewer heat sources to pre‐heated air before it exits the system. Additionally, the location of the heat source reaching the highest temperature is found to be highly dependent on the TCC of the bonding material between the heat source and the substrate. A hybrid optimization strategy is employed, by combining Artificial Neural Network (ANN) and Genetic Algorithm (GA) for optimizing the location of heat sources. ANN is used for predicting the temperature distribution, subsequently followed by GA to minimize the maximum temperature attained by the heat generating source by varying other control variables like TCC thickness, inlet velocity, and heat generation. The thickness of the bonding layer is varied from 0.225 to 0.271 mm and the heat generation is varied from 1000 to 2000 W/m2. Among them, TCC is observed to be an important parameter controlling the optimum location of heat generating sources. The results obtained from the proposed hybrid optimization strategy are compared with the simulation results and observed to be reasonably close.

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Additive manufacturing of polymer composite millimeter‐wave components: Recent progress, novel applications, and challenges

Ma,

Dong,

et al. 2024

Polymer Composites

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With the advent of 5G/6G for radar and space communication systems, various millimeter‐wave (MMW) components are rapidly innovated for multi‐functional, higher integrated and miniaturized solutions across diverse industries and applications. Polymer composites‐based additive manufacturing (AM), an advanced manufacturing technique, can manufacture MMW components with high fabrication resolution, intricate structural design, adjustable dielectric properties, and functionally gradient distribution characteristics. This paper outlines the state‐of‐the‐art polymer composite MMW components, their design, and manufacturing techniques. An integrated “material‐structure‐manufacturing‐performance” design conceptual framework of polymer composite MMW components is discussed in terms of material design, structure design, and process design. Moreover, multi‐functional polymer composite MMW structures focus on electromagnetic wave absorption and electromagnetic interference (EMI) shielding functions. Moreover, novel applications of MMW polymer composite components enabled by AM on radar/sensing, communication, enclosure, and miscellaneous applications are discussed. Furthermore, future perspectives and current challenges are identified to provide new insights into multi‐functional 3D‐printed MMW products, exploring new possibilities for next‐generation advanced MMW technology.HighlightsThe 3D‐printed MMW components and additive manufacturing are reviewed.The integrated “material‐structure‐manufacturing‐performance” concept is introduced.3D‐printed MMW components are discussed on radar, enclosure, and miscellaneous applications.Future perspectives and challenges of 3D‐printed MMW components are addressed.

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Printed circuit board embedded power semiconductors: A technology review

Cited by 16 publications

References 55 publications

New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications

New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications

Effect of Interface Bonding on Optimizing the Heat Transfer in Substrate Board With an Array of Heat Sources

Additive manufacturing of polymer composite millimeter‐wave components: Recent progress, novel applications, and challenges

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