Printed circuit board insertion loss measurement metrology comparison

Hsu, Jimmy; Su, Thonas; Xiao, Kai; Ye, Xiaoning; Li, Y. L.

doi:10.1109/impact.2015.7365202

Cited by 8 publications

(4 citation statements)

References 1 publication

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“…degrading the failure risk of inner connection defect by setting a lower service time for drilling needles, turning down drilling speed and applying plasma desmear process; optimizing laminating and electroplating parameters to obtain better thickness uniformity of copper and dielectric, the accuracy of line width/pitch and layer-to-layer registration; mitigating the stub effect on signal integrity by applying an appropriate back-drilling technology; and selecting organic solderability preservatives or immersion silver as surface treatment when demanding a lower loss, while soldering reliability shall also be considered (Hsu et al, 2015;Wu et al, 2008).…”

Section: Manufacturing Process Requirementsmentioning

confidence: 99%

“…To satisfy the main technical specifications of 16∼24 layers with 2∼3 stages high-density interconnect, array holes with 0.4-mm pitch and thickness of 2.4∼3.0 mm on harder laminates with better chemical resistance for PCBs in the mm-wave application, more precision controlling procedures are required on manufacturing processes, which are summed up as follows: degrading the failure risk of inner connection defect by setting a lower service time for drilling needles, turning down drilling speed and applying plasma desmear process; optimizing laminating and electroplating parameters to obtain better thickness uniformity of copper and dielectric, the accuracy of line width/pitch and layer-to-layer registration; mitigating the stub effect on signal integrity by applying an appropriate back-drilling technology; and selecting organic solderability preservatives or immersion silver as surface treatment when demanding a lower loss, while soldering reliability shall also be considered (Hsu et al , 2015; Wu et al , 2008). …”

Section: Key Technical Demands On Pcb In 5g Mm-wave Applicationmentioning

confidence: 99%

“…selecting organic solderability preservatives or immersion silver as surface treatment when demanding a lower loss, while soldering reliability shall also be considered (Hsu et al , 2015; Wu et al , 2008).…”

Section: Key Technical Demands On Pcb In 5g Mm-wave Applicationmentioning

confidence: 99%

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Investigation on the new reliability issues of PCB in 5G millimeter wave application

He,

Huang,

Xiao

et al. 2023

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Purpose The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology. Design/methodology/approach The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test. Findings To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated. Originality/value The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

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Section: Manufacturing Process Requirementsmentioning

confidence: 99%

Section: Key Technical Demands On Pcb In 5g Mm-wave Applicationmentioning

confidence: 99%

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Investigation on the new reliability issues of PCB in 5G millimeter wave application

He,

Huang,

Xiao

et al. 2023

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“…In the studies performed by Jiang et al (2010), Shiue et al (2014), Hsu et al (2015), Zenteno et al (2010), Zhou and Lu (2013) and Guan and Zhou (2013), the return and insertion loss of different via models were analyzed up to 20 GHz. However, the analysis of eye diagram was excluded in some of these researches.…”

Section: Effect Of Via Stubmentioning

confidence: 99%

Techniques of impedance matching for minimal PCB channel loss at 40 GBPS signal transmission

Yee

Isa

Al‐Hadi

et al. 2019

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Purpose This paper aims to analyze the negative impact of surface mount (SMT) pad and imperfect via structure such as stub, pad, non-functional pad (NFP) and anti-pad on the signal integrity at 40 Gbps transmission on printed circuit board (PCB) due to impedance mismatch or discontinuity. The optimized modeling of via and SMT structures is performed to achieve minimal impedance mismatch and insertion loss less than 10 dB for six-inch full path transmission line between transmitter and receiver on PCB at Nyquist frequency 20 GHz. Design/methodology/approach This work is split into two phases. The first phase involves optimization of via and SMT structures in three-dimensional electromagnetic (3DEM) simulation using Hyperlynx Via Wizard and Keysight EMPro software, respectively, followed by analysis of time domain reflectometry (TDR) and insertion loss (Sdd21). Whereas, in the second phase, full path hybrid mode simulation involving vias for signal layer transition, a 6-inch PCB channel and SMT pads is performed using Keysight ADS software to observe the TDR, Sdd21 and eye diagram at 40 Gbps transmission. Findings Imperfect via and SMT structures have a negative effect on signal reflection and attenuation. The optimized via and SMT minimizes the impedance mismatch by 81 per cent and insertion loss by 4.5 dB, ultimately enlarging the eye diagram opening to achieve minimal data loss at receiver with 40 Gbps transmission. Originality/value The results of original empirical research work on signal integrity analysis that optimizes the PCB channel design to achieve 40 Gbps signal transmission are presented in this study. It serves as a reference guide for high-speed PCB layout design.

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New surface treatment method for copper foils to improve signal integrity of printed circuit board

Chen

et al. 2016

2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

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Printed circuit board insertion loss measurement metrology comparison

Cited by 8 publications

References 1 publication

Investigation on the new reliability issues of PCB in 5G millimeter wave application

Investigation on the new reliability issues of PCB in 5G millimeter wave application

Techniques of impedance matching for minimal PCB channel loss at 40 GBPS signal transmission

New surface treatment method for copper foils to improve signal integrity of printed circuit board

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