Printed electronic processes for flexible hybrid circuits and antennas

Church, Kenneth H.; MacDonald, Eric; Clark, Patrick A.; Taylor, Robert B.; Paul, David F.; Stone, Kelly; Wilhelm, Michael J.; Medina, Francisco; Lyke, James; Wicker, Ryan B.

doi:10.1109/fedc.2009.5069282

Cited by 17 publications

(7 citation statements)

References 18 publications

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“…nFD produces relatively rough surfaces, and in combination with microdispensed conductive pastes creates a rough path for high frequency signals [2]. There is also a need for methodologies that adjust the printing process while printing since the inks can change consistency throughout the process [18]. We found that the lower permittivity of the ABS plastic led to designs utilizing a thinner substrate.…”

Section: Discussionmentioning

confidence: 93%

High-Frequency Filters Manufactured Using Hybrid 3d Printing Method

Robles¹,

Bustamante²,

Darshni³

et al. 2019

PIER M

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In this work, two different high-frequency filters were produced, and each was manufactured in two different ways, one using conventional PCB technology and the other using hybrid 3D printing. The hybrid 3D printing technique combined the use of microdispensing of conductive inks and fused filament fabrication (FFF) of thermoplastic substrates. Measurements, properties, and comparisons between these filters are discussed. The goal of the research was to benchmark 3D printing of highfrequency filters to more confidently manufacture sophisticated devices and high-frequency systems by hybrid 3D printing.

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Section: Discussionmentioning

confidence: 93%

High-Frequency Filters Manufactured Using Hybrid 3d Printing Method

Robles¹,

Bustamante²,

Darshni³

et al. 2019

PIER M

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“…The two photocurable resins discussed above were used in the fabrication of the test parts: DSM Somos V R , ProtoTherm TM 12120, and WaterShed TM 11120 due to the differences in glass transition temperatures. Two conductive inks which have been utilized in the creation of hybrid flexible and structural electronics [22][23][24][25][26][27] were used to print the interconnect and via structures: Ercon E1660 (Ercon Incorporated, Wareham, MA) and DuPont CB028, (DuPont, Wilmington, DE). As our test structure also employed internal routings, two via/plug, pastes were also included in our experiments: DuPont CB100 and CB102.…”

Section: Methodsmentioning

confidence: 99%

“…Inkjet printing, microdispense, and manual application are all viable methods for the application of conductive inks and pastes which can then be utilized as conductive paths to connect the individual components in an electronic device. While the use of printing techniques alone has been demonstrated as a capable method for the production of functional devices such as junction transistors, [21] the current state of the art for the fabrication of electronic components, which make use of printing methodologies, falls in to the realm of hybrid electronic devices such as a physically flexible graphics driver explained by Church et al [22] which was a hybridization of ink-based electrical interconnects printed on a flexible Kapton V R substrate with commercially available microchip components integrated into the system. The combination of AM technology with DW techniques has created another paradigm of electronics manufacturing-structural or 3D electronics as discussed by Lopes et al [23].…”

Section: Introductionmentioning

confidence: 99%

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

Roberson

Wicker

MacDonald

2015

Journal of Electronic Packaging

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Ohmic curing was utilized as a method to improve the conductivity of three-dimensional (3D) interconnects printed from silver-loaded conductive inks and pastes. The goal was to increase conductivity of the conductive path without inducing damage to the substrate. The 3D via/interconnect structure was routed within 3D polymeric substrates and had external and internal sections. The 3D structures were created by the additive manufacturing (AM) process of stereolithography (SL) and were designed to replicate manufacturing situations which are common in the fabrication of 3D structural electronics that involve a combination of AM and direct write (DW) processing steps. The photocurable resins the 3D substrates were made of possessed glass transition temperatures of 75 C and 42 C meaning that a nonthermal method to increase the conductivity of the printed traces was needed as the conductive inks tested in this study required oven cure temperatures greater than 100 C to perform properly. Ohmic curing was shown to decrease the measured resistance of the via/interconnect structure without harming the substrate. Substrate damage was observed on thermally cured samples and was characterized by discoloration and scaling of the substrate. Resistance measurements of the via/interconnect structures revealed samples cured by the ohmic curing process performed equal or better than samples subjected to thermal curing. The work presented here demonstrates a method to overcome the thermal cure temperature limitations of polymeric substrates imposed on the processing parameters of conductive inks during the fabrication of 3D structural electronics and presents an example of overcoming a manufacturing process problem associated with this emerging technology. An ink selection process involving characterization of the compatibility of inks with the substrate material and the use of different inks for the via and interconnect sections was also discussed.

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“…Using standard vat photopolymerization and thermoplastic extrusion, previous work has demonstrated 3D printed electronics using both printed inks and embedded wires for interconnection [11], [14]- [16], [23]- [30]. Ink conductors can suffer from low conductivities as the curing temperature is limited by the max temperature of the polymer substrate; conductive inks have been used to connect components and sensors and provide substantial manufacturing flexibility (e.g.…”

Section: Introductionmentioning

confidence: 99%

3D Printed Elastomeric Lattices With Embedded Deformation Sensing

et al. 2020

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New durable elastomeric materials are commercially available for 3D printing, enabling a new class of consumer wearable applications. The mechanical response of soft 3D printed lattices can now be tailored for improved safety and comfort by (a) leveraging functional grading and (b) customizing the outer envelope to conform specifically to the anatomy of the subject (e.g. patient, athlete, or consumer). Furthermore, electronics can be unobtrusively integrated into these 3D printed structures to provide feedback relating to athletic performance or physical activity. A proposed sensor system was developed that weaves unjacketed wires at two distinct layers in a lattice to form a complex capacitor; the capacitance increases as the lattice is compressed and can detect lattice deformation. A structure was fabricated and demonstrated with both static compression as well as low-velocity impact to highlight the utility for wearable applications. This work is focused on improving the performance of American football helmets as highlighted by the National Football League (NFL) Helmet Challenge Symposium; however, the lattice sensing concept can be extended to metal and ceramic lattices as well-relevant to the automotive and aerospace industries.

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Printed electronic processes for flexible hybrid circuits and antennas

Cited by 17 publications

References 18 publications

High-Frequency Filters Manufactured Using Hybrid 3d Printing Method

High-Frequency Filters Manufactured Using Hybrid 3d Printing Method

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

3D Printed Elastomeric Lattices With Embedded Deformation Sensing

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