Printed Electronics Based on 2D Material Inks: Preparation, Properties, and Applications toward Memristors

Abstract

Printed electronics, which fabricate electrical components and circuits on various substrates by leveraging functional inks and advanced printing technologies, have recently attracted tremendous attention due to their capability of large‐scale, high‐speed, and cost‐effective manufacturing and also their great potential in flexible and wearable devices. To further achieve multifunctional, practical, and commercial applications, various printing technologies toward smarter pattern‐design, higher resolution, greater production flexibility, and novel ink formulations toward multi‐functionalities and high quality have been insensitively investigated. 2D materials, possessing atomically thin thickness, unique properties and excellent solution‐processable ability, hold great potential for high‐quality inks. Besides, the great variety of 2D materials ranging from metals, semiconductors to insulators offers great freedom to formulate versatile inks to construct various printed electronics. Here, a detailed review of the progress on 2D material inks formulation and its printed applications has been provided, specifically with an emphasis on emerging printed memristors. Finally, the challenges facing the field and prospects of 2D material inks and printed electronics are discussed.

Nanoscale memristor devices: materials, fabrication, and artificial intelligence

“…Typical deposition technologies include but are not limited to screen printing, inkjet printing, extrusion-based 3D printing, aerosol printing, electrohydrodynamic (EHD) printing, gravures, and laser direct writing. 221,227 In some cases, spin coating and/or spraying are used for uniform component development if patterning of layers is not required. Table 1 displays different features of printing techniques for memristor fabrication.…”

Solution-Processable and Printable Two-Dimensional Transition Metal Dichalcogenide Inks

“…Printing memristors with solution-processed TMD ink materials is a promising research direction. ,,,,− For example, by alternately aerosol-jet printing Ag ink and MoS 2 ink on a flexible polyimide substrate, Feng et al fabricated Ag/MoS 2 /Ag vertical memristors in a cross-bar structure (Figure a, b) . The printed devices exhibit nonvolatile switching characteristics with an ultralow switching voltage (0.18 V) at a current compliance of 200 μA and a high switching ratio (10 7 ) (Figure c).…”

Exploring the Self‐Cleaning Facets of Fluorinated Graphene Nanoarchitectonics: Progress and Perspectives

“…The factors such as non‐porosity, re‐stacking and low sorption ability connected to bulk FG, can be tailored into ‘functional inks’ that are reactive, dispersible and paintable formulations (Figure 5) by means of chemical or mechanical delamination. The ability to formulate functional inks with respect to structural and tribological applications via controlling the lateral sizes and number of FG layers from the 2D dispersions will have promising implications in packaging and coatings sector [85,86] . In particular, the key to decipher the lateral sizes and thickness (few v/s multi‐layers) of FG nanosheets, besides fluorine content/bonding type effect can be controllable via sonication time and amplitude.…”

“…The ability to formulate functional inks with respect to structural and tribological applications via controlling the lateral sizes and number of FG layers from the 2D dispersions will have promising implications in packaging and coatings sector. [85,86] In particular, the key to decipher the lateral sizes and thickness (few v/s multi-layers) of FG nanosheets, besides fluorine content/bonding type effect can be controllable via sonication time and amplitude. The CÀ F bonding type, bonding distribution, the fluorine content, and the extent of functionalization essentially controls the opto-electronic, dielectric, magnetic, physiochemical, electrochemical, tribological and hydrophobicity of the FG nanosheets.…”