Printing of uniform PZT thin films for MEMS applications

Bathurst, Stephen; Kim, Sung Hoon

doi:10.1016/j.cirp.2013.03.113

Cited by 12 publications

(8 citation statements)

References 11 publications

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“…Received: January 16,2014 Final Version: February 27, 2014 C [284] ZrC [160] TiC/Ni [289] Al 2 O 3 -ZrO 2 [191] Polymer-derived ceramics: see present work Functional ceramics BaTiO 3 [40,41] PZT [89] PZT [211,223,239] BaTiO 3 [150] SiO 2 -Al 2 O 3 -RO-glass [269] PZT [37,[45][46][47] BaTiO 3 [115] SiCN [225] PZT [145,146] LZSA-Glass [272] TiO 2 [43,44] PMN [192] PZT [282] LSMO/YBCO [48] LiFePO 4 [170] Li 4 Ti 5 O 12 BaZrO 3 , SrTiO 3 , BaMn 2 Al 10 O 19À x [193] ITO [119] ZnO [119,187] La(Mg 0.5 , Ti 0.5 )O 3 [167,188] Zr 0.8 Sn 0.2 TiO 4 [188] TiO 2 [119] Bioceramics HA [50,66,67,[69][70][71][72] Apatite-Mullite [107][108]…”

Section: Discussionmentioning

confidence: 99%

“…Suspensions of PZT powders in a methylethyl ketone/ethanol [45] and paraffin/oil mixtures [46] have also been prepared, demonstrating the suitability for ink-jet printing. Bathurst and Kim [47] printed a piezoelectric micro-machined transducer from PZT sol-gel inks. The possibility of manufacturing coatings from electroceramics using DIP was effectively demonstrated by printing La 0.7 Sr 0.3 MnO 3 -and YBa 2 Cu 3 O 7À x -based inks.…”

Section: Three-dimensional Printing (3dp)mentioning

confidence: 99%

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Additive Manufacturing of Ceramic‐Based Materials

et al. 2014

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This paper offers a review of present achievements in the field of processing of ceramic-based materials with complex geometry using the main additive manufacturing (AM) technologies. In AM, the geometrical design of a desired ceramic-based component is combined with the materials design. In this way, the fabrication times and the product costs of ceramic-based parts with required properties can be substantially reduced. However, dimensional accuracy and surface finish still remain crucial features in today's AM due to the layer-by-layer formation of the parts. In spite of the fact that significant progress has been made in the development of feedstock materials, the most difficult limitations for AM technologies are the restrictions set by material selection for each AM method and aspects considering the inner architectural design of the manufactured parts. Hence, any future progress in the field of AM should be based on the improvement of the existing technologies or, alternatively, the development of new approaches with an emphasis on parts allowing the near-net formation of ceramic structures, while optimizing the design of new materials and of the part architecture.

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Section: Discussionmentioning

confidence: 99%

Section: Three-dimensional Printing (3dp)mentioning

confidence: 99%

Additive Manufacturing of Ceramic‐Based Materials

et al. 2014

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“…The piezoelectric film and structure of pMUT are two important factors that affect the sensitivity. ZnO and PZT films are usually used as piezoelectric layers in pMUTs [ 15 , 16 , 17 , 18 , 19 , 20 ]. Compared with that of PZT film the deposition process of ZnO film is simple and compatible with micromachining technology [ 21 , 22 , 23 , 24 , 25 , 26 , 27 ].…”

Section: Introductionmentioning

confidence: 99%

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Ren

Fan

et al. 2017

Sensors

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A square piezoelectric composite diaphragm was analyzed by the finite element method to enhance the sensitivity of a piezoelectric micromachined ultrasound transducer (pMUT). The structures of electrode and piezoelectric film were optimized and a centric electrode was designed to avoid the counteraction of stress in the centre and edges. In order to further improve the sensitivity; a pMUT with partially-etched piezoelectric film was adopted. The receive and transmit sensitivities of the pMUT were analyzed in details. The receive sensitivity of pMUT with partially-etched ZnO film is 3.3 dB or 6.8 dB higher than those with a centric and whole electrode, respectively; and the amplitude of a partially-etched ZnO film pMUT under a certain voltage is 5.5 dB and 30 dB higher than those with centric and whole electrode separately. Two pMUT-based ZnO films were fabricated by micromachining technology and their receive and transmit sensitivities were tested. The ZnO films deposited by direct current (DC) magnetron sputtering exhibit a densely packed structure with columnar crystallites. The test results show that the structure of the square diaphragm with partially-etched piezoelectric layer can significantly improve the transducer sensitivity. The receive sensitivity and transmit sensitivity are −238.35 dB (ref. 1 V/μPa) and 150.42 dB (ref. 1 μPa/V); respectively.

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“…Transverse stress in the active piezoelectric layer is formed from the applied electric field, which causes the membrane to displace outof-plane, generating a pressure wave in the outer medium 46 . Different piezoelectric materials have been produced in the PMUTs, such as PZT 47 , zinc oxide (ZnO) 48 , and aluminum nitride (AlN) 49 . With a low operating frequency of kHz range, ZnO-based PMUTs are not suitable for IVUS probes that usually operate in MHz range 50 .…”

Section: Piezoelectric Micromachined Ultrasound Transducermentioning

confidence: 99%

Capacitive micromachined ultrasound transducers for intravascular ultrasound imaging

et al. 2020

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Intravascular ultrasound (IVUS) is a burgeoning imaging technology that provides vital information for the diagnosis of coronary arterial diseases. A significant constituent that enables the IVUS system to attain high-resolution images is the ultrasound transducer, which acts as both a transmitter that sends acoustic waves and a detector that receives the returning signals. Being the most mature form of ultrasound transducer available in the market, piezoelectric transducers have dominated the field of biomedical imaging. However, there are some drawbacks associated with using the traditional piezoelectric ultrasound transducers such as difficulties in the fabrication of high-density arrays, which would aid in the acceleration of the imaging speed and alleviate motion artifact. The advent of microelectromechanical system (MEMS) technology has brought about the development of micromachined ultrasound transducers that would help to address this issue. Apart from the advantage of being able to be fabricated into arrays with lesser complications, the image quality of IVUS can be further enhanced with the easy integration of micromachined ultrasound transducers with complementary metal-oxide-semiconductor (CMOS). This would aid in the mitigation of parasitic capacitance, thereby improving the signal-to-noise. Currently, there are two commonly investigated micromachined ultrasound transducers, piezoelectric micromachined ultrasound transducers (PMUTs) and capacitive micromachined ultrasound transducers (CMUTs). Currently, PMUTs face a significant challenge where the fabricated PMUTs do not function as per their design. Thus, CMUTs with different array configurations have been developed for IVUS. In this paper, the different ultrasound transducers, including conventional-piezoelectric transducers, PMUTs and CMUTs, are reviewed, and a summary of the recent progress of CMUTs for IVUS is presented.

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Printing of uniform PZT thin films for MEMS applications

Cited by 12 publications

References 11 publications

Additive Manufacturing of Ceramic‐Based Materials

Additive Manufacturing of Ceramic‐Based Materials

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Capacitive micromachined ultrasound transducers for intravascular ultrasound imaging

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