Printing technology for ubiquitous electronics

Abstract

If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to analyze the economics of various printing processes proposed for small-scale electronic products such as radio frequency identification tags, smart cards, and wireless sensors, and to present a new transfer printing method. Design/methodology/approach -The costs of several types of microstructuring techniques were calculated from commercial product data, along with a detailed spreadsheet simulation of inkjet printing for microelectronics. A new material for transfer printing was developed, along with suitable tooling for placing small and thin dice on flexible substrates. Findings -The cost analysis of inkjet printing suggests that it may not be substantially less expensive than conventional silicon technology for this purpose, while achieving inferior performance. Offset printing is cheaper but further from practicality. The new transfer printing process successfully prints very small silicon dice at high speed, and appears to meet the market needs with respect to cost, product performance and flexibility in readily producing different designs.Research limitations/implications -The cost analysis depends on assumptions which are not all well known, and which change with time. The new method has not yet been run in a high-volume production mode. Such experience will be necessary to fully confirm its value. Originality/value -This analysis identifies cost factors which have not been generally appreciated in public discussions of printed electronics. The transfer printing process offers a unique way to make cost-effective use of silicon integrated circuits which are much smaller than any that appear in products today, and may have ramifications beyond the original target of tags and sensors.

Paper Electronics

“…[ 40 ] While these paper coatings compromise the low cost and recyclability, this might still be acceptable for relatively high-value electronic applications that require relatively expensive materials, many processing steps, and encapsulation. [ 41 ] The cost of a plastic-coated paper might, however, become too large (or a too substantial part) in situations when the electronics are truly low cost and robust, i.e., consisting R2R-printed low-cost materials and do not require encapsulation. Furthermore, the recyclability or biodegrability might be a very essential constraint in some cases.…”

Laser-Induced Silver Seeding on Filter Paper for Selective Electroless Copper Plating

“…The development of high-resolution metal patterns has allowed for significant progress in applications of the microelectronics industry such as surface-mount devices and integrated circuits [1], radio frequency identification and smart cards [2], wireless sensors and temperature sensors (T-sensor) [2,3,4], super hydrophobic surfaces [5], and flexible electronics [6]. In particular, in the wearable electronics industry, the flexible circuit board is a key element for boarding microelectronic devices.…”

Printable low-cost sensor systems for healthcare smart textiles

“…Among the popular printing technologies, screen printing and gravure is well suited for mass produced electronics on textile because they are parallel printing technology and the substrate handling. 7,8 The attribute of parallel printing, as compared to serial printing technologies like ink jet printing, help to increase throughput towards low cost production. These technologies enable fabrication (over a large surface area) of electronics with varied functionality: sensor systems and flexible printed circuit for embedded wireless telemetry systems.…”

“…These technologies enable fabrication (over a large surface area) of electronics with varied functionality: sensor systems and flexible printed circuit for embedded wireless telemetry systems. [7][8][9] Flexible substrates like polyimide (Kapton), Mylar, Polyethylenenapthalate (PEN), PET have been in use for printed electronics fabrication. 8 A similar process can be accomplished on fabric substrate.…”