Copper injected anodically into eutectic Na-K nitrate melt at 300~ is shown to deposit cathodically as cupric oxide (CuO). The dissolved copper is in the +2 oxidation state and apparently forms a nitrate complex that facilitates reduction of nitrate to oxide (and nitrite) at potentials more than a volt positive of that for reduction of the Na/K nitrate species. From these results and literature studies, cathodic metal oxide deposition from nitrate melts appears to be a general phenomenon that could prove to be a practical means of preparing anhydrous metal oxide films.Oxide films are of interest for a variety of practical applications, including corrosion protection, batteries, high temperature superconductors, catalysts, electronic devices, and flat panel displays. In many cases, anhydrous films are required, but oxides produced by electrodeposition from aqueous electrolytes generally are at least partially hydrated. Dehydration can be effected by thermal treatments, but the film quality attained is typically degraded because atomic/molecular rearrangements are involved. This is unfortunate since the electrodeposition approach is ideally suited to coating large areas and irregular substrates and can provide close control over the deposition process. One possibility for directly-electrodepositing anhydrous metal oxides is to use a molten salt solvent.Several studies 1-5 have indicated that oxides of a wide range of metals, rather than the free metals themselves, are deposited from nitrate melts. Since the observed reduction potentials in some cases are up to a volt positive of the potential required for nitrate reduction in the background Na-K nitrate melt, it has been proposed that metal oxide deposition occurs via a nitrate complex, 3-~ i.e., according tofor a divalent cation. Note that rapid nitrate reduction produced by high cathodic polarization in the pure Na-K nitrate melt results in deposition of sodium oxide, but the deposit eventually redissolves. ~ The present work was directed toward demonstrating that metallic oxide deposition from nitrate melts indeed occurs. Because of the technological importance of transition metals, a member of this group, copper, was chosen for study. Some previous workers 6-8 suggested that copper metal itself is deposited, but they did not verify the nature of the deposits produced. In these earlier studies, Cu 2+ was dissolved as either the nitrate (stabilized by addition of KHSQ) or the chloride, and shown to introduce a diffusion-limited reduction wave (Pt electrode) with an onset at about +0.3 V vs. Ag/Ag+. 6.7 Note that the onset voltage was identical whether Cu 2 § was added as the chloride or nitrate, suggesting that the melt species might be the same in either case. Previous work 9'1~ also indicates that metallic Cu spontaneously forms Cu20 in nitrate melts and that passivation, involving formation of CuO, occurs at about -0.1 V vs. Ag/Ag + electrode.
Experimental DetailsCell and glove box.--Figure I depicts the molten satt electrochemical cell assembly used in the pr...