2021
DOI: 10.1088/1361-6439/ac404b
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Process and device simulations aimed at improving the emitter region performance of silicon PERC solar cells

Abstract: Achieved levels of Silicon-based passivated emitter and rear cell (PERC) solar cells' laboratory and module-level conversion efficiencies are still far from the theoretically achievable Auger limit of 29.4% for silicon solar cells, prominently due to emitter recombination and resistive losses. The emitter region in PERC devices is formed by using either ion implantation followed by a diffusion process or POCl3 diffusion. In ion-implanted emitter-based PERC, the process variables such as dose, energy, diffusion… Show more

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Cited by 9 publications
(7 citation statements)
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“…Afterward, an n + emitter has been formed on the front surface with the help of ion implantation and diffusion process. Different processes such as etching, material deposition of stacked layers, front and rear metallization have been performed (25). Then, an optimized dielectric passivation stack of SiNX (70 nm)/SiO2 (10 nm) for front Si surface passivation and Al2O3 (10 nm)/SiNX (100 nm) stacked materials for rear surface passivation are used.…”
Section: Device Analysis and Simulations Methodologymentioning
confidence: 99%
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“…Afterward, an n + emitter has been formed on the front surface with the help of ion implantation and diffusion process. Different processes such as etching, material deposition of stacked layers, front and rear metallization have been performed (25). Then, an optimized dielectric passivation stack of SiNX (70 nm)/SiO2 (10 nm) for front Si surface passivation and Al2O3 (10 nm)/SiNX (100 nm) stacked materials for rear surface passivation are used.…”
Section: Device Analysis and Simulations Methodologymentioning
confidence: 99%
“…Different tunneling parameters such as QTNLSC.EL, QTNLSC.HO, QTNLSC.BBT and QTNL.DERIVS are invoked in this work to perform the charge carriers (electrons/holes) and band-to-band tunneling (27). Also, different models such as the Schenk bandgap narrowing model (28), Richter model for Auger recombination (29), and Klaassen mobility model (30) as per the published work have been employed (22,25). The performance of the double-POLO PERC device is accomplished by varying the thickness of the tunnel oxide layer on the front surface.…”
Section: Device Analysis and Simulations Methodologymentioning
confidence: 99%
“…The diffusion process was allowed to run for 30 minutes at a temperature of 950 C, and all the process parameters for the ion-implanted emitter were optimized in a previous work. 36 As a result, the p-n junction was formed, as depicted in Fig. 1.…”
Section: Process Simulationmentioning
confidence: 99%
“…[37][38][39] Further, the transient activation model was utilised to compute activated dopants that were accommodated into the substitutional lattice out of the total chemical concentration of the implanted phosphorous. 36 The excess dopants that fail to unite are considered to be deactivated. The point at which this occurs at a particular temperature for a particular semiconductor is known as the solid solubility limit.…”
Section: Process Simulationmentioning
confidence: 99%
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