Process-Dependent Contact Characteristics of NCA Assemblies

Non-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCA

“…13,14) Conventionally, electro-less Au/Ni bumps, electroplated gold bumps, and polymer based composite-bumps are used as the bump material. 12,[15][16][17] Sn bumps have a lower hardness and higher plastic deformation capability than an Au bump. Several articles have been devoted to the study of COG technology using Sn bumps.…”

Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

“…Flip chip assembly using a non-conductive adhesive (NCA) has been recently reported [11][12][13][14][15][16][17][18][19]. This technology realizes direct electrical contact between bumps on a chip and the pads of the substrate.…”

Thermal–mechanical optimization of a novel nanocomposite-film typed flip chip technology

“…Among the existing packaging technologies, the adhesive-based FC technologies (see, e.g., [1][2][3][4][5][6][7]) can be an engaging option for very fine-pitch interconnection. However, existing technologies, such as the particle-based anisotropic conductive film/adhesive (ACF/A) technology (e.g., [1,2]), consist of certain technical limitation, especially when I/O pitch is less than 40 lm or even down to 30 lm.…”

“…It is however found that there presents some technical challenges in achieving a high aspect-ratio pillar structure using a standard photolithography technique, and in addition, those metal posts or flakes are not structurally compliant. Note that the lack of structural compliance of the metal posts or flakes would potentially result in reliability issue at an elevated temperature, just as the conventional nonconductive film/paste (NCF/P) technology (e.g., [5][6][7]). …”