Process Development and Integration for Wafer-to-Wafer Hybrid Bonding

Li, Hongyu; Ji, Hong; Chen, Gim Guan; Kiat, Alfred Neo Siang; Dickson, Teo Wei Jie; Chui, King-Jien

doi:10.1109/eptc56328.2022.10013123

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022

DOI: 10.1109/eptc56328.2022.10013123

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Process Development and Integration for Wafer-to-Wafer Hybrid Bonding

Hongyu Li

Hong Ji

Gim Guan Chen

et al.

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Process Development and Integration for Wafer-to-Wafer Hybrid Bonding

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