2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS) 2019
DOI: 10.1109/memsys.2019.8870649
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Process Development of Low Resistive Ag-Based Through Silicon Vias using Inkjet Printing Technique for 3D Microsystem Integration

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Cited by 2 publications
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“…Quack et al [241] developed ink-jetted Au-filled TSV arrays. Yang et al [242] deposited Ag and filled a via at a lower processing temperature and electrical resistivity, and further enhanced its electrical performance [243].…”
Section: ) Mems Packagingmentioning
confidence: 99%
“…Quack et al [241] developed ink-jetted Au-filled TSV arrays. Yang et al [242] deposited Ag and filled a via at a lower processing temperature and electrical resistivity, and further enhanced its electrical performance [243].…”
Section: ) Mems Packagingmentioning
confidence: 99%