2008
DOI: 10.1007/978-3-540-76664-3_8
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Process Diagnostics

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Cited by 6 publications
(7 citation statements)
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“…ALD is a smooth chemical vapor deposition technique, expected to leave hydroxide OH groups on the surface. Conversely, PSD might induce a more homogeneous ionic surface state; O − and O 2 − could be typically introduced due to the small amount of reactive oxygen gas that is added to the neutral argon gas during sputtering [48].…”
Section: Resultsmentioning
confidence: 99%
“…ALD is a smooth chemical vapor deposition technique, expected to leave hydroxide OH groups on the surface. Conversely, PSD might induce a more homogeneous ionic surface state; O − and O 2 − could be typically introduced due to the small amount of reactive oxygen gas that is added to the neutral argon gas during sputtering [48].…”
Section: Resultsmentioning
confidence: 99%
“…In the 'on' phase it is negative with a deep valley of about À900 V about 2 ms after switching before it settles at a value of about À200 V. In the 'off' phase it attains high positive values of up to þ260 V immediately after switching before, after some oscillations, it settles at about þ40 V. V Pl has been found to follow these changes in the 'off' phase but keeps close to zero in the 'on' phase. [9,15,22] Because the energy of the positive ions which are formed in the plasma bulk is determined by V Pl , the IEDFs reproduce the changes in V Pl . The peak at 7 eV (cf.…”
Section: Discussionmentioning
confidence: 99%
“…The periodic interruption or reversal of the discharge voltage leads on the other hand to strong temporal changes of the plasma parameters (see e.g. [7]- [14]) which make a physical description even more difficult, and a tailoring of the deposition process for pulsed magnetron sputtering is to date practically impossible.…”
Section: Introductionmentioning
confidence: 99%