2018
DOI: 10.1108/mi-04-2017-0017
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Process factors affecting adhesion of encapsulation molding compounds

Abstract: Purpose The purpose of this paper is to determine the key process factors which affect the adhesion strength of encapsulation molding compounds (EMCs) to leadframes to obtain reliable components without any need to pretreat the leadframe surface. Design/methodology/approach EMCs were molded to Cu leadframes to experimentally quantify the effect of mold temperature, resin viscosity, leadframe oxidation and powder moisture on the adhesion force. Component reliability was assessed by PCT. Findings A higher mo… Show more

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