Process-induced residual stress in a single carbon fiber semicrystalline polypropylene thin film

Parambil, Nithin K.; Chen, Branndon R.; Gillespie, John W.

doi:10.1016/j.compositesa.2023.107969

Composites Part A: Applied Science and Manufacturing

2024

DOI: 10.1016/j.compositesa.2023.107969

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Process-induced residual stress in a single carbon fiber semicrystalline polypropylene thin film

Nithin K. Parambil,

Branndon R. Chen,

John W. Gillespie

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2024

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Cited by 2 publications

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Study of stress distribution in the various interfaces present in the 3D printing microelectronic systems: applies to boxes produced by additive manufacturing

Houmimi,

Benaissa,

Zaghar

et al. 2024

Int J Adv Manuf Technol

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Study of stress distribution in the various interfaces present in the 3D printing microelectronic systems: applies to boxes produced by additive manufacturing

Houmimi,

Benaissa,

Zaghar

et al. 2024

Int J Adv Manuf Technol

View full text Add to dashboard Cite

Experimental investigation of warpage in thin CF/PEKK composite laminates consolidated under non-isothermal conditions

Al-Dhaheri,

Irfan,

Cantwell

et al. 2024

Journal of Thermoplastic Composite Materials

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In this study, we investigated the effect of several processing conditions on warpage in carbon-fibre/PEKK composites manufactured under non-isothermal conditions. A multi-level factorial design of experiments was employed to study the effect of process and design parameters on warpage. Analysis-of-variance was used to establish the significance of the main factors as contributors to warpage. The number of plies and consolidation pressure were the factors that contributed significantly to warpage. A regression model was used to predict the warpage of panels consolidated using aluminium tooling, giving a reasonably good prediction of less than 18% difference. A panel with variable thickness was also manufactured, based on the prior observations, pressure and lay-up configurations were successfully altered to reduce warpage. DSC results showed that the warpage of semi-crystalline PEKK composites consolidated under non-isothermal conditions is a result of a differential in shrinkage across the laminate, as the degree of crystallinity varied with temperature and consolidation pressure.

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Process-induced residual stress in a single carbon fiber semicrystalline polypropylene thin film

Cited by 2 publications

References 39 publications

Study of stress distribution in the various interfaces present in the 3D printing microelectronic systems: applies to boxes produced by additive manufacturing

Study of stress distribution in the various interfaces present in the 3D printing microelectronic systems: applies to boxes produced by additive manufacturing

Experimental investigation of warpage in thin CF/PEKK composite laminates consolidated under non-isothermal conditions

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