“…The process temperature, speed, compaction pressure [1][2][3][4][5], fiber path planning [6][7][8][9], and processinduced defects [10][11][12] are the important factors for developing a proper bonding quality at the interface between the tape and substrate to manufacture products with high mechanical performance. In addition, optimal ranges of the tape winding and placement parameters such as tape tension and roller force are necessary to reduce the void content [13,14] and residual stress [15,16] and to increase the tensile strength [13,15], interlaminar shear strength [17,18], peel strength [19,20], and production rate [16,18,19] The nip point temperature serves as an indicator for the process temperature and might vary during the LATW process, possibly resulting in a substantial variation in the consolidation quality. For instance, the nip point temperature increases significantly with the increase of substrate thickness during the continuous multi-layer hoop winding process due to heat accumulation in previously wound layers [21,22].…”