1982
DOI: 10.1016/s0007-8506(07)63284-3
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Process Modelling of Forging with Heated Dies — Application to a Nickel-Base-Alloy

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Cited by 4 publications
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“…The stress increment between V avg = 25 mm/s and 5 mm/s was approximately 60 MPa. This is because the forging duration became long and the workpiece temperature was expected to be sharply dropped down by heat transfer at the die-workpiece interface [12]. Irrespective of the forging speed, the compressive stress with the TiCN composite die was lower than that with the other die materials, especially the compressive stress with the die was approximately 20% lower than that with the other die materials at V avg < 10 mm/s.…”
Section: Upsetting Load and Materials Flowmentioning
confidence: 99%
“…The stress increment between V avg = 25 mm/s and 5 mm/s was approximately 60 MPa. This is because the forging duration became long and the workpiece temperature was expected to be sharply dropped down by heat transfer at the die-workpiece interface [12]. Irrespective of the forging speed, the compressive stress with the TiCN composite die was lower than that with the other die materials, especially the compressive stress with the die was approximately 20% lower than that with the other die materials at V avg < 10 mm/s.…”
Section: Upsetting Load and Materials Flowmentioning
confidence: 99%