Process optimization and reliability study for Cu wire bonding advanced nodes

Qin, Ivy; Xu, Huining; Milton, Basil; Mendoza, Nestor; Clauberg, Horst; Chylak, Bob; Abe, Hideaki; Kang, Dongchul; Endo, Yoshinori; Osaka, Masahiko; Nakamura, Shinya

doi:10.1109/ectc.2014.6897496

Cited by 8 publications

(2 citation statements)

References 8 publications

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“…A lot of development has been done in wire, molding compound and manufacturing process to improve the molded reliability for Cu wire under humid conditions. Pd coated Cu wire, Pd doped alloy Cu wire [2,3,4], green molding compound with low halogen content and ion trappers [2,5,6] all showed significant improvement for Cu wire bonding reliability. Fine pitch Cu wire bonding reliability is proven in manufacturing process [7].…”

Section: Wire Type Comparisonmentioning

confidence: 99%

Advances in Wire Bonding Technology for Different Bonding Wire Material

Qin

Shah

et al. 2015

International Symposium on Microelectronics

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With all the advances in 2.5D and 3D packaging, wire bonding is still the most popular interconnect technology and the workhorse of the industry. Wire bonding technology has been the lower cost solution comparing to flip chip. Wire bonding package cost is much reduced with the introduction of Copper wire bonding. Technology development and innovation in wire bonding provides new packaging solutions that improves performance and reduces cost. This paper reviews the recent innovations in ball bonding technology to provide optimized ball bonding solutions targeted for different bonding wire material. It examines the different challenges for the alternative wire types including Cu wire, Pd coated, and AuPd coated Cu wire and Ag Alloy wire. We will discuss key development in ball bonding equipment, process and material to overcome the challenges and provide robust low cost solutions. The advantages of each wire type are outlined, and guidelines to select the right bonding wire type per application requirements are provided.

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Section: Wire Type Comparisonmentioning

confidence: 99%

Advances in Wire Bonding Technology for Different Bonding Wire Material

Qin

Shah

et al. 2015

International Symposium on Microelectronics

Self Cite

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“…The most common materials for wire bonds are aluminum and copper, due to good workability and low electrical resistance. Many studies in literature focus on the reliability of the interface between wire ball and package/device metal pads [1][2][3][4][5][6]. For example, J. Gomes and M. Mayer have presented the effect of ball bond geometry on reliability of 25μm copper wire [6].…”

Section: Introductionmentioning

confidence: 99%

Reliability model of LED package regarding the fatigue behavior of gold wires

Altieri-Weimar

Yuan

Annibale

et al. 2016

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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In this study the mechanical properties and fatigue behavior of ultra-fine gold wires are investigated by experimental tension fatigue tests and finite element (FE) simulation. Hardening behavior, yield criterion and yield surface of gold wire are determined by tensile tests and force controlled tension fatigue tests. The relationship between plastic strain and loading stress amplitude is determined and the cyclic strain hardening coefficient is calculated. The fatigue data are used to develop a predictive crack model for gold wires bonded in LED packages, based on finite element (FE) stress simulation at temperature cycles (TC). The computer model of the gold wire in the LED package used in the simulation is reconstructed from computer tomography (CT) analysis. The predictive crack model is calibrated using on-line monitoring of LED wire cracks during TC tests. Finally, using the reliability model, the impact of LED package design and material on the wire lifetime is investigated.

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Development of advanced wire bonding technology for QFN devices

Rezvani

Brunner

et al. 2015

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

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Process optimization and reliability study for Cu wire bonding advanced nodes

Cited by 8 publications

References 8 publications

Advances in Wire Bonding Technology for Different Bonding Wire Material

Advances in Wire Bonding Technology for Different Bonding Wire Material

Reliability model of LED package regarding the fatigue behavior of gold wires

Development of advanced wire bonding technology for QFN devices

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