Process Optimization of Foil-Based Transient Liquid Phase Bonding for Die Attachment

Feisst, Markus; Jan, Kustermann; Schumacher, Axel; Spies, Irina; Wilde, Jürgen

doi:10.1109/isse.2019.8810295

Cited by 5 publications

(7 citation statements)

References 3 publications

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“…where s o is the initial yield stress; R o and R 1 are the linear and exponential terms coefficients (in stress units); b is the exponential saturation parameter; and e p is the equivalent plastic strain. works of the authors (Feißt et al, 2019a(Feißt et al, , 2019bFeisst, 2023) and plugged into the FEA models of the PCB and DCB substrate to simulate the TLP layer response due to temperature loading profile. It is important to emphasize that such literature-based material coefficients, listed in Table 4, were measured using the same tensile testing setup and conditions discussed in the present paper and obtained for the same multilayer AgSn TLP foil configurations.…”

Section: Stress-strain Relationshipsmentioning

confidence: 99%

“…Silicon (Hull, 1999) Copper (Gharaibeh and Al-Oqla, 2023) FR4 (Gharaibeh and Al-Oqla, 2023) Al 2 O 3 (Wang et al, 2001) AgSn TLP (Feißt et al, 2019a(Feißt et al, , 2019b Elastic prone to earlier failures when they are used on the PCB substrates.…”

Section: Mechanical Propertymentioning

confidence: 99%

“…The AgSn-TLP configuration, indeed, offers one major advantage is that it produces on two IMC phases, Ag 3 Sn (e-phase) and Ag 5 Sn (z-phase) and exhibits a tendency for Kirkendall void during the IMC (Ag 3 Sn ! z) transformation (Lis and Leinenbach, 2015;Mokhtari, 2019;Moeini et al, 2014;Feißt et al, 2019aFeißt et al, , 2019b. This ends up with a relatively high melting point of the AgSn TLP bonds (Sun et al, 2020;Rheingans et al, 2022).…”

Section: Introductionmentioning

confidence: 99%

“…Which is claimed to be because of the variability of the testing methods and equipment and because of the anisotropy of the Ag 3 Sn compound (Kumar and Jung, 2013). Feißt et al (2019a), 2019b used tensile tests and optical measurements to investigate the elastic-plastic mechanical properties of nine-layer AgSn TLP foils and produced a bilinear isotropic hardening material models for the temperature range of 25°C-200°C. In their model, they estimated the elastic and tangent moduli as well as yield and ultimate tensile strengths of the AgSn-TLP bonds.…”

Section: Introductionmentioning

confidence: 99%

“…Consequently, the Ag-Sn-Ag configuration is heated to a temperature above the melting point of the Sn allowing for the diffusion process between the solid–liquid phase to initiate, resulting in a thermally stable bonds (Feißt et al , 2018). The AgSn-TLP configuration, indeed, offers one major advantage is that it produces on two IMC phases, Ag 3 Sn ( ϵ -phase) and Ag 5 Sn ( ζ -phase) and exhibits a tendency for Kirkendall void during the IMC (Ag 3 Sn → ζ ) transformation (Lis and Leinenbach, 2015; Mokhtari, 2019; Moeini et al , 2014; Feißt et al , 2019a, 2019b). This ends up with a relatively high melting point of the AgSn TLP bonds (Sun et al , 2020; Rheingans et al , 2022).…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Gharaibeh,

Feisst,

Wilde

2024

SSMT

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Purpose This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils. Design/methodology/approach The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads. Findings The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints. Originality/value In literature, there is no constitutive modeling data on the AgSn TLP bonds.

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Section: Stress-strain Relationshipsmentioning

confidence: 99%

Section: Mechanical Propertymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Gharaibeh,

Feisst,

Wilde

2024

SSMT

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Fast and Reliable Ag–Sn Transient Liquid Phase Bonding by Combining Rapid Heating with Low-Power Ultrasound

Rheingans

Jeurgens

Janczak‐Rusch

2022

Metall Mater Trans A

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Ag–Sn transient liquid phase (TLP) bonding is capable of producing joints with excellent mechanical and thermal properties, and with operation temperatures at or even above the processing temperature. However, reduction of the comparatively long processing times required to achieve high-quality joints is highly desirable. To this end, the use of fast heating and low-power ultrasonic (US) pulses for accelerated Ag–Sn TLP bonding is investigated with particular focus on defect generation and avoidance. Employing rapid heating with $$20\,{\text {K s}}^{-1}$$ 20 K s - 1 , the process time can indeed be strongly reduced, yielding a high average shear strength of $$(58 \pm 22)$$ ( 58 ± 22 ) MPa. The large variance of the shear strength is caused by gas entrapment and pronounced lateral squeeze-out of liquid Sn, facilitated by the suppression of $${\text{Ag}}_{3} {\text{Sn}}$$ Ag 3 Sn formation upon rapid heating. Introduction of a weak US pulse leads to enhanced $${\text{Ag}}_{3} {\text{Sn}}$$ Ag 3 Sn formation and efficient removal of entrapped gas, and thus to avoidance of large-scale bond defects, which results in an enhanced shear strength of $$(104 \pm 8)$$ ( 104 ± 8 ) MPa.

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A study on the thermomechanical response of various die attach metallic materials of power electronics

Gharaibeh,

Wilde

2024

SSMT

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Purpose In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis. Design/methodology/approach During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined. Findings The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations. Originality/value This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

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Process Optimization of Foil-Based Transient Liquid Phase Bonding for Die Attachment

Cited by 5 publications

References 3 publications

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing

Fast and Reliable Ag–Sn Transient Liquid Phase Bonding by Combining Rapid Heating with Low-Power Ultrasound

A study on the thermomechanical response of various die attach metallic materials of power electronics

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