Process Signatures - The Missing Link to Predict Surface Integrity in Machining

Brinksmeier, E.; Meyer, Daniel; Heinzel, Carsten; Lübben, Th.; Sölter, Jens; Langenhorst, L.; Frerichs, F.; Kämmler, J.; Kohls, Ewald; Kuschel, Sven

doi:10.1016/j.procir.2018.05.006

Cited by 62 publications

(21 citation statements)

References 26 publications

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“…As outlined by Brinksmeier et al [3], the concept of Process Signatures seeks to describe material modifications M in terms of internal material loads L rather than machining parameters (Correlation I), as shown in Figure 10a. This correlation is defined as the Process Signature (PS), represented by functional performing Process Signature Components (PSC) according to M = f (L).…”

Section: Notation For Process Signatures Of Multi-cycle Loadsmentioning

confidence: 99%

“…Frequently, extensive iteration steps are necessary in order to generate a desired surface finish. This prompts development of correlations that describe material modifications by means of internal material loads [3] generalized of the explicit machining parameters and manufacturing processes [4]. Such a knowledge-based description of a manufacturing process is called a Process Signature (PS) [5].…”

Section: Introductionmentioning

confidence: 99%

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Multi-Cycle Process Signature of Laser-Induced Thermochemical Polishing

Eckert

2019

JMMP

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Laser-induced thermochemical polishing (LCP) is a non-conventional processing technique that uses laser radiation to smooth the surface of self-passivated metallic parts by initiating a localized anodic material dissolution. This technology can be used to selectively micro-polish without the need for masking or thermal and mechanical stress. However, there is still a lack in understanding the surface quality depending on the applied laser machining parameters. This paper takes up the concept of Process Signatures and interprets the surface smoothing as result of multiple, recurring internal material loads of a constant energy amount. The laser-induced thermal impact is identified as the relevant internal material load and is correlated with the surface roughness. This derives an empirical-based functional relation as multi-cycle Process Signature. The experiment results show an exponential decay in surface roughness with increasing cycle loads for titanium, Ti6Al4V, Nitinol, Stellite 21, and metallic glass. The Process Signature of LCP is a solution to a differential equation with respect to the cycle loads. The paper demonstrates how the multi-cycle Process Signature helps determine suitable machining parameters to predict the surface roughness, as well as to scale the polishing rate.

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Section: Notation For Process Signatures Of Multi-cycle Loadsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Multi-Cycle Process Signature of Laser-Induced Thermochemical Polishing

Eckert

2019

JMMP

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“…It is expected that the utilization of Process Signatures should enable a comparability of apparently different machining processes, assuming that similar internal material loads will lead to similar material modifications. Consequently, Process Signatures are assumed to facilitate the solution of the so-called inverse problem in manufacturing [14].…”

Section: Evolutionary View On Surface Integritymentioning

confidence: 99%

“…Due to the objective to trace back the impact of the manufacturing process on the surface integrity to its causal mechanisms, Process Signatures have to be identified on the macro-and microstructural scale. Of course, these two scales are closely related to each other and the scaling within a Process Signature is an important objective for future work [14]. mechanisms in the material and, from there, discussing the reasons why these mechanisms are activated in the process, relevant internal material loads can be identified.…”

Section: Meaning and Notationmentioning

confidence: 99%

“…When analyzing the internal material loads of processes with a mechanical main impact, the available Process Signature Components as presented by Meyer and Kämmler [15], Brinksmeier et al [14] and Langenhorst et al [16] focus on strains and strain fields in the subsurface layers. The investigations deal with deep rolling and grind strengthening (grinding with mechanical main impact).…”

Section: Exemplary Process Signature Component For Processes With a Mmentioning

confidence: 99%

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Underlying Mechanisms for Developing Process Signatures in Manufacturing

et al. 2018

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The concept of Process Signatures allows the reliable and knowledge-based prediction of material modifications (e.g., changes of hardness, residual stress, microstructure and chemical composition) researchers in the field of surface integrity, and manufacturing technologies have already been seeking for a long time. A Process Signature is based on the correlation between the internal material loads in manufacturing processes (e.g., stress, strain, temperature) and the resulting material modifications. The target of this paper is to get a comprehensive view on the development of single Process Signature Components for processes with different predominant impacts. Particularly, a mechanism-based approach leading to significant descriptives of internal material loads for a specific material modification is proposed. By this, a deeper understanding of the underlying mechanisms leading to changes of the workpiece surface layer properties caused by manufacturing processes is provided. The challenging identification of significant mechanisms and descriptives of internal material loads is highlighted for each process, and supporting measurement methods and modeling approaches are presented. Process Signatures are expected to enable the solution of the so-called inverse problem in manufacturing.

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Dynamics of chip formation during the cutting process using imaging techniques: A review

Nie

Yang

Zhang

et al. 2022

Int Journal of Mech Sys Dyn

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Imaging techniques have been widely implemented to study the dynamics of chip formation. They can offer a direct method and a full field measurement of the cutting process, providing kinematic information of the chip formation process. In this article, the state of the art of the imaging techniques reported in the literature has been summarized and analyzed. The imaging techniques have been applied to study the chip formation mechanism, friction behavior, strain/strain rate, and stress fields. Furthermore, the study of surface integrity has been advanced by deriving the thermo‐mechanical loading, subsurface deformation, and material constitutive model from the imaging technique. Finally, achievements in the area of imaging techniques have been summarized, followed by future directions for their application in the study of surface integrity.

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Process Signatures - The Missing Link to Predict Surface Integrity in Machining

Cited by 62 publications

References 26 publications

Multi-Cycle Process Signature of Laser-Induced Thermochemical Polishing

Multi-Cycle Process Signature of Laser-Induced Thermochemical Polishing

Underlying Mechanisms for Developing Process Signatures in Manufacturing

Dynamics of chip formation during the cutting process using imaging techniques: A review

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