Process Technology for Copper Interconnects

Gambino, Jeff

doi:10.1016/b978-0-12-812311-9.00006-2

Cited by 10 publications

(1 citation statement)

References 178 publications

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“…Copper (Cu) is extensively used in industrial applications owing to its advantages in high electrical and thermal conductivity, excellent antibacterial and mechanical properties, and corrosion and electromigration resistance. 1 Cu coatings with a high surface area have been widely studied for diverse applications such as current collectors in lithium metal batteries, 2,3 surface-enhanced Raman scattering sensors, 4 heat sinkers, 5 superhydrophobic surfaces, 6 and electrocatalysts 7,8 as well as the electrical interconnection. 9 Therefore, studies about the fabrication and shape-control of Cu coatings have been favored by researchers.…”

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confidence: 99%

Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition

Tang¹,

Yan²,

Han³

et al. 2022

J. Electrochem. Soc.

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Copper (Cu) coatings with a high surface area have attracted significant attention for functional devices due to their high thermal and electrical properties. Pulse-reverse current (PRC) electrodeposition has been introduced to fabricate Cu coatings for a long history, but little attention has been paid to the synergistic effects of anodic and cathodic steps instead of the individual anodic step. The new parameter “artificial exchange current density” (jA) has been demonstrated to quantify the effects of anodic and cathodic currents on the morphology in our previous work. Herein, a key metricthe relative current amplitudethat is positively correlated with jA, is used to further clarify the role of jA in the electrodeposition process. We fabricate Cu coatings with well-dispersed pyramid-like structures and find the relative current amplitude dominates the formation of a larger raised structure at the initial nucleation stage. Moreover, the anodic current can dissolve high-energy planes and achieve a high (111) texture. Afterward, screw dislocation drives the spiral growth of grains, resulting in pyramid-like structures. This study not only enriches our understanding of the artificial exchange current density in PRC electrodeposition but also guides us to achieve Cu coatings with high surface area.

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confidence: 99%

Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition

Tang¹,

Yan²,

Han³

et al. 2022

J. Electrochem. Soc.

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Effect of encapsulation on electronic transport properties of nanoscale Cu(111) films

Shinde

Adiga

Pandian

et al. 2019

Sci Rep

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The stiff compromise between reliability and conductivity of copper interconnects used in sub-nanometer nodes has brought into focus the choice of encapsulation material. While reliability was the primary driver so far, herein, we investigate how electronic conductivity of Cu(111) thin films is influenced by the encapsulation material using density functional theory and Boltzmann transport equation. Atomically thin 2D materials, namely conducting graphene and insulating graphane both retain the conductivity of Cu films whereas partially hydrogenated graphene (HGr) results in reduction of surface density of states and a reduction in Cu film conductivity. Among transition metal elements, we find that atoms in Co encapsulation layer, which essentially act as magnetic impurities, serve as electron scattering centres resulting in a decrease in conductivity by at least 15% for 11 nm thick Cu film. On the other hand, Mo, Ta, and Ru have more favorable effect on conductivity when compared to Co. The cause of decrease in conductivity for Co and HGr is discussed by investigating the electronic band structure and density of states. Our DFT calculations suggest that pristine graphene sheet is a good encapsulation material for advanced Cu interconnects both from chemical protection and conductivity point of view.

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A New, Computationally Efficient “Blech Criterion” for Immortality in General Interconnects

Shohel

Chhabria

Sapatnekar

2021

2021 58th ACM/IEEE Design Automation Conference (DAC)

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Process Technology for Copper Interconnects

Cited by 10 publications

References 178 publications

Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition

Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition

Effect of encapsulation on electronic transport properties of nanoscale Cu(111) films

A New, Computationally Efficient “Blech Criterion” for Immortality in General Interconnects

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