Metrology, Inspection, and Process Control for Microlithography XXIII 2009
DOI: 10.1117/12.814063
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Process variation monitoring (PVM) by wafer inspection tool as a complementary method to CD-SEM for mapping LER and defect density on production wafers

Saar Shabtay
1
,
Yuval Blumberg
2
,
Shimon Levi
3
et al.
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