Polymer composites with low dielectric constant and high thermal conductivity are gaining considerable attention due to their rising demand in various microelectronic applications such as printed circuit boards, connectors, encapsulations, and electrical contacts. In the present investigation, thermal and dielectric properties of a new class of epoxy-based hybridized composites with improved thermal conductivity (k), high glass transition temperature (T g ), low coefficient of thermal expansion (CTE), controlled dielectric constant (D k ), and low dielectric loss (D L ) have been reported. Epoxy-based composites are fabricated by solution casting method with various wt% (0, 5, 10, 15, and 20 wt%) of short hair fiber and with a fixed proportion of micro-sized boron nitride (BN) (10 wt%) particles. Effects of fiber content on different thermal properties of the composites such as effective thermal conductivity (k), CTE, and T g are