2022
DOI: 10.1111/jace.18334
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Processing map to control the erosion of Y2O3 in fluorine based etching plasmas

Abstract: Due to the increasing number of applications for ceramic components in reactive etching processes, the interest in the specific erosion behavior of highly etchresistant materials like yttrium oxide (Y 2 O 3 ) has increased in the past years.Despite the large number of investigations already existing in this field, a more general understanding of the erosion mechanisms still lacks due to the limited comparability of these investigations. The huge difference in the kind of etching setups, processing parameters (… Show more

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Cited by 13 publications
(8 citation statements)
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“…26 This test was conducted under power conditions slightly stronger than those previously used in research because it was necessary to study various etching mechanisms, including chemical, mixing, and physical etching of the ceramics. 12,27 The ceramic samples were exposed to fluorinecontained plasma for 1 h. After plasma etching, the samples were subjected to ultrasonic cleaning to eliminate the masking tape remaining on specimens and to more accurately analyze the etching depths and surface roughness.…”
Section: ■ Experimental Sectionmentioning
confidence: 99%
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“…26 This test was conducted under power conditions slightly stronger than those previously used in research because it was necessary to study various etching mechanisms, including chemical, mixing, and physical etching of the ceramics. 12,27 The ceramic samples were exposed to fluorinecontained plasma for 1 h. After plasma etching, the samples were subjected to ultrasonic cleaning to eliminate the masking tape remaining on specimens and to more accurately analyze the etching depths and surface roughness.…”
Section: ■ Experimental Sectionmentioning
confidence: 99%
“…The chemical etching behavior seems to have a trend similar to that seen in previous research. 12 However, a high bias voltage of 600 V is applied that forms irregularly distributed micropores and craters and further damaged areas on the Y 2 O 3 ceramic surface. This is because the dominant etching mechanism changes to a mixed and physical erosion mechanism derived from generated ions and radicals accelerated under an electric field.…”
Section: ■ Experimental Sectionmentioning
confidence: 99%
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