1998
DOI: 10.1016/s0921-4534(98)00372-4
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Processing of low cost Bi-2212 tapes

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Cited by 15 publications
(2 citation statements)
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“…Several studies have reported the use of Ni and Ni-based alloys in composite structures with Ag for the fabrication of Bi-2212 tapes, and various means of preventing interaction between the Bi-2212 and Ni have been described in these reports [4]- [7]. Meng [4] deposited a thin Cr/Ag-Pd layer as the buffer on the Ni, while Yamada [5] used NiO as the buffer.…”
Section: Introductionmentioning
confidence: 99%
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“…Several studies have reported the use of Ni and Ni-based alloys in composite structures with Ag for the fabrication of Bi-2212 tapes, and various means of preventing interaction between the Bi-2212 and Ni have been described in these reports [4]- [7]. Meng [4] deposited a thin Cr/Ag-Pd layer as the buffer on the Ni, while Yamada [5] used NiO as the buffer.…”
Section: Introductionmentioning
confidence: 99%
“…Meng [4] deposited a thin Cr/Ag-Pd layer as the buffer on the Ni, while Yamada [5] used NiO as the buffer. The NiO layer was formed in-situ by annealing in air.…”
Section: Introductionmentioning
confidence: 99%