2003
DOI: 10.1117/12.478595
|View full text |Cite
|
Sign up to set email alerts
|

Processing of metals and semiconductors by a femtosecond laser-based microfabrication system

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
12
0

Year Published

2005
2005
2022
2022

Publication Types

Select...
7
2

Relationship

0
9

Authors

Journals

citations
Cited by 30 publications
(12 citation statements)
references
References 20 publications
0
12
0
Order By: Relevance
“…6 Since these effects, which result in poor feature quality of the machined work piece, are created or magnified by the passage of the optical beam through dielectric material, e.g., air, machining is normally conducted in vacuum, which restricts its application in the production environment. 7 Among others, 8 use of inert gases as media for beam delivery has been suggested for these reasons, e.g., helium, because of its high ionization potential, 9,10 but the inconvenience persists.…”
Section: Introductionmentioning
confidence: 99%
“…6 Since these effects, which result in poor feature quality of the machined work piece, are created or magnified by the passage of the optical beam through dielectric material, e.g., air, machining is normally conducted in vacuum, which restricts its application in the production environment. 7 Among others, 8 use of inert gases as media for beam delivery has been suggested for these reasons, e.g., helium, because of its high ionization potential, 9,10 but the inconvenience persists.…”
Section: Introductionmentioning
confidence: 99%
“…Cutting speeds up to 9.2 mm/s have been reported [2], however the line focus used to improve cutting speed removes the ability to cut nonlinear shapes. Net cutting speeds on the order of 8 µm/s [4,5] are more typical, however the thin wafers (i.e., low cutting depths ~50 µm) used in these studies limit applications to solar devices rather than the thicker silicon typically used in heterojunction devices [6].…”
Section: Introductionmentioning
confidence: 99%
“…of conical structures, we make a gaussian shaped hole in the surface. These high fluences are often used for fast machining and cutting of silicon because a large amount of material is removed with each pulse [35].…”
Section: Effect Of Fluencementioning
confidence: 99%