“…The damage resistance of scratches vs etched depth was investigated, and the average results of LIDT at the specific etched depth were obtained as the diamond data in Figure show. Although the damage characteristics of scratches are affected by multiple factors in addition to the size of scratches, the bluntness of cracks, etc., our results suggest that deep etching (~25 μm) benefits the LIDT improvement of brittle scratches in that the scratches are blunted and the lateral cracks are vanished by deep etching that is highly deleterious to damage resistance of fused silica. The average of LIDT for 1, 1.5, and 2 N scratches is increased to ~9.1, 6.9, and 6.4 J/cm 2 , respectively, when the material removal amount is ~25 μm.…”