“…The present work used discs of lead-free solder (SN100C ® ), 4 mm in diameter and 0.2 mm in thickness, fabricated from 50 μm mono-disperse solder balls by ultrasonic powder consolidation (UPC), a rapid low-temperature powder consolidation technique described elsewhere (Gunduz, 2006; under conditions optimized for the solder balls (consolidation temperature: 100 °C, consolidation time: 3 s, vibration amplitude: 9 μm, uniaxial pressure: 100 MPa). The mono-disperse solder balls were prepared by a capillary molten jet breakup process described in previous study (Ando, 2012).…”