Production of metal foams by using powder metallurgy method

Hassan, Zainab Kassim

doi:10.1063/1.5116931

Cited by 4 publications

(1 citation statement)

References 11 publications

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“…The reasons for joining two distinct sorts of substance can diverse before analysts. Thus, a gathering of scientists can expect for leading the mechanical features of the blended substances [4]. Porous substances had found huge applications as channels, synergist supports, and warm separators.…”

Section: Introductionmentioning

confidence: 99%

Evaluating the Influence of Adding Natural Materials to Copper and Zinc Compounds

Hassan

2022

MSF

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This article produced porous materials by using a simple and easy method which is a powder metallurgy. This search studying an experimental fulfillment on the thermal conductivity, apparent porosity, and Diametrical Strength of porous copper-zinc manufactured by the convert to carbon since firing process and combined with the oxygen cause to CO2 gas that rises up to air and leaves the number of pores. the basic metals are Cu and Zn pure powder metals with a different ratio (10-20-30)% of natural leaves especially palm leaves which is widely found in our natures, Cu fine powder (220 µm) has purity 99.5% as a matrix material to prepared composite material with ratio 80% of material total weight, 500g, Zn fine powder added as 20% from material total weight, the Zn metallic powder has purity 99.5%. The Zn powders have size particle less than200 m. Grounded palm leaves were cut to small parts then milled by using electrical mortar to get a fine powder which have a green size (less than 0.75 m) which result by sieving instruments. The results show various values in each test. In physical testing the apparent porosity from pure \Cu-Zn has 0.11%,10%0.187%,20% 0.22,30%0.32%,where the higher value for samples of palm leaves which has presence in a higher value in 30% of palm leaves, the others tests in thermal conductivity and diametric strength, in thermal conductivity have(5 W/m.k for pure material, in 10% 0.65 W/m.k, in20% 0.38 W/m.k,in 30% 0.2 W/m.k)for Cu-Zn-P.L composites these investigations show a decreasing ingredients especially in 30%, which have the lower value with the same effect in Diametrical Strength in pure samples has 25Mpa,in 10% has 10 Mpa, in 20%6Mpa,in30% 2.5Mpa.Generally the Optimum properties of Cu-Zn-P.L additives are attained with least porosity content. The existences of porosity decline the Diametrical Strength, thermal conductivity. Thus the aim of this study was to create porous composites metal MMC with has high attractive as an insulating material, and porous composites with natural additives.

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Section: Introductionmentioning

confidence: 99%

Evaluating the Influence of Adding Natural Materials to Copper and Zinc Compounds

Hassan

2022

MSF

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Evaluation of Metal Foam of Al6061 + MgO Using PM Route

Rathod

Goyal

Tomar

et al. 2021

Advances in Manufacturing Systems

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Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal–organic decomposition

Wang,

Tatsumi,

Nishikawa

2024

J Mater Sci

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In wide-bandgap semiconductor power device packaging, die bonding refers to attaching the die to substrate. Thereby, the process temperature of Ag sintering for the die bonding should be low to prevent damage to fragile dies. Herein, an organic-free strategy using Ag nanostructures derived from the thermal decomposition of metal–organic decomposition (MOD) was proposed to achieve low-temperature bonding. Significant effects on bonding performance were determined by the thermal decomposition temperature, which in turn determined the organic content and sintering degree of Ag nanostructures. At a low thermal decomposition temperature of 160 °C, incomplete decomposition resulted in high organic content in the Ag nanostructures, causing large pores inside the Ag joints owing to the generation of gaseous products. Owing to the Ag particles with naked surfaces and wide size distribution, the Ag nanostructure obtained at 180 °C showed an excellent bonding performance, resulting in a high shear strength of 31.1 MPa at a low bonding temperature of 160 °C. As the thermal decomposition temperature was 200 °C, sintering among Ag particles increased the particle size, resulting in a reduction of surface energy and driving force for sintering. We think that uncovering this underlying mechanism responsible for the bonding performance will promote the application of Ag MOD in the die bonding of WBG power devices. Graphical abstract

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Production of metal foams by using powder metallurgy method

Cited by 4 publications

References 11 publications

Evaluating the Influence of Adding Natural Materials to Copper and Zinc Compounds

Evaluating the Influence of Adding Natural Materials to Copper and Zinc Compounds

Evaluation of Metal Foam of Al6061 + MgO Using PM Route

Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal–organic decomposition

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