2013 15th European Conference on Power Electronics and Applications (EPE) 2013
DOI: 10.1109/epe.2013.6634487
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Prognostic capability evaluation of power electronic modules in transportation electrification and vehicle systems

Abstract: Health management and reliability are fundamental part of the design and development cycle of the power electronic products. This paper presents the study and investigation about the prognostic and health management of power electronic IGBT module. To achieve this aim, a fusion approach has been introduced. In addition, for the physic based part of approach, a thermal model is used to predict temperatures of inaccessible locations within the power module. Then by employing the rainflow algorithm, the remaining… Show more

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Cited by 4 publications
(3 citation statements)
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“…As shown in Fig.1.7, where the red squares refer to the failed components, and the green squares refer to different stressors. It is concluded that the IGBT and chip resistors are critical components according to these specific different research activity in the literature [45], [46], [47], [48], [49], [20], [50], [42], [51], [40], [52], [53], [26], [54], [55], [56], [57], [39], [58], [59], [60], [61], [62], [63] and [64]. It can be concluded from this figure that the thermal cycles are a very common source of failure in the power electronics of the electro-mobile applications.…”
Section: Component Failures In Power Electronics In Electro Mobility mentioning
confidence: 99%
“…As shown in Fig.1.7, where the red squares refer to the failed components, and the green squares refer to different stressors. It is concluded that the IGBT and chip resistors are critical components according to these specific different research activity in the literature [45], [46], [47], [48], [49], [20], [50], [42], [51], [40], [52], [53], [26], [54], [55], [56], [57], [39], [58], [59], [60], [61], [62], [63] and [64]. It can be concluded from this figure that the thermal cycles are a very common source of failure in the power electronics of the electro-mobile applications.…”
Section: Component Failures In Power Electronics In Electro Mobility mentioning
confidence: 99%
“…Alghassi et al has discussed different failures mechanisms related to IGBT and they have also presented prognosis model for the dominant failure at a component level in [21] [22]. From system level prognostics, changes in the energy transfer in Cuk converter can be used to detect earlier sign of degradation and failure.…”
Section: A Dc-dc Convertermentioning
confidence: 99%
“…Alghassi et al has discussed different failures mechanisms related to IGBT and they have also presented prognosis model for the dominant failure at a component level in [29] [30]. IGBT experiences a number of failure mechanisms including: bond wire fatigue, bond wire lift up, corrosion of the wires, static and dynamic latch up, loose gate control voltage, etc.…”
Section: Prognostics Of Dc-to-dc Convertermentioning
confidence: 99%