Programmable Micro-Object Assembly with Transfer

Plochowietz, Anne; Wang, Yunda; Shreve, Matthew; Crawford, Lara S.; Raychaudhuri, Sourobh; Butylkov, Sergey; Rupp, Bradley B.; Wang, Qian; Wang, Yu; Kalb, Jamie; Lu, Jeng Ping; Chow, Eugene M.

doi:10.1109/transducers.2019.8808800

Cited by 4 publications

(6 citation statements)

References 11 publications

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“…[63] The second driving force is toward developing high-resolution Micro-LED display, for which millions of Micro-LEDs must be assembled onto a driving backplane. In the latter case, a variety of Micro-LED transfer techniques have been developed, including polydimethylsiloxane (PDMS) stamp transfer, [5,27,118,119] electrostatic transfer, [120] fluid assembly, [121,122] laser-based transfer, [46,[48][49][50] magnet-assisted transfer, [123] roll-to-roll, [121] tape transfer, [124,125] Figure 9. a) Schematic drawing of the LLO process used for releasing the temporary glass carrier.…”

Section: Chip Mass Transfermentioning

confidence: 99%

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Gong

2022

Adv Materials Technologies

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Micro light‐emitting diode (Micro‐LED) display is an emerging display technology thanks to its high brightness, fast switching speed, and low power consumption. The commercialization of this technique is being explored by developing advanced processing techniques on an industrial scale. Recent ground‐breaking advances in the manufacture of Micro‐LEDs are mainly based on powerful laser micro/nano‐processing techniques with the unique ability to fabricate materials, structures and devices with the advantages of non‐contacting processing, high efficiency, adjustable coverage from micro‐ to macroscale and the compatibility with organic and inorganic materials. This paper categorizes, reviews and analyzes the main challenges and technical solutions in the Micro‐LED displays by various laser manufacturing processes, covering chip dicing, geometry shaping, laser annealing, laser lift‐off (LLO), laser‐based Micro‐LED transfer, laser‐assist bonding (LAB) and laser repair. The fundamental principles of these techniques are discussed along with their basic mechanisms, followed by an exploration of the latest progress in the field. Finally, a detailed analysis of the advantages and disadvantages of these techniques is given, and the future research directions of laser techniques in Micro‐LED display are discussed.

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Section: Chip Mass Transfermentioning

confidence: 99%

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Gong

2022

Adv Materials Technologies

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“…Electrostatic assembly exploits the adhesive force induced by an external electric field across a set of conductive electrodes to manipulate microcomponents [ 281 , 282 , 283 , 284 , 285 , 286 , 287 , 288 , 289 ]. In other words, charged microcomponents can be trapped by patterned surface areas with localized electrical fields.…”

Section: Chip-scale Transfer Techniquesmentioning

confidence: 99%

“…Several investigations into electrostatic field force have mainly been focused on manipulation of microparticles [ 284 ]. However, this concept was also explored for macroscale wafer handling [ 283 ] and microscale device assembly [ 281 , 283 , 286 , 287 , 288 , 289 ].…”

Section: Chip-scale Transfer Techniquesmentioning

confidence: 99%

“…Recently, the commercial feasibility of this technique for microchip manipulation has been investigated. For instance, PARC has developed a microcomponent printer based on this concept [ 289 ] ( Figure 28 a–c). Microscale chips are suspended in aqueous solvents.…”

Section: Chip-scale Transfer Techniquesmentioning

confidence: 99%

“…( d ) Chiplets assembled in an array and ( e ) heterogenous chiplet assembly of chips of different sizes. Adapted with permission from [ 289 ]. Copyright IEEE, 2019.…”

Section: Figurementioning

confidence: 99%

See 2 more Smart Citations

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review

Gong

2021

Nanomaterials

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Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a variety of new layer transfer and chip-scale transfer technologies have been developed. In this review, we summarize such transfer techniques for heterogeneous integration of ultrathin semiconductor layers or chips to a receiving substrate for many applications, such as microdisplays and flexible electronics. We showed that a wide range of materials, devices, and systems with expanded functionalities and improved performance can be demonstrated by using these technologies. Finally, we give a detailed analysis of the advantages and disadvantages of these techniques, and discuss the future research directions of layer transfer and chip transfer techniques.

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Assembly of Solder Beads with a Surface Mount Technology Resistor with Optoelectronic Tweezers and Freezing-Drying Techniques

Elhanashi,

Saponara,

Dini

et al. 2024

Lecture Notes in Electrical Engineering

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Programmable Micro-Object Assembly with Transfer

Cited by 4 publications

References 11 publications

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review

Assembly of Solder Beads with a Surface Mount Technology Resistor with Optoelectronic Tweezers and Freezing-Drying Techniques

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