2022
DOI: 10.1016/j.mee.2021.111704
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Progress in SiC nanowire field-effect-transistors for integrated circuits and sensing applications

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Cited by 20 publications
(25 citation statements)
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“…Compared with 2D materials, NWs are more suitable for high integration and low power consumption synaptic devices. Nowadays, NWs have been integrated into diodes [30], field effect transistors (FETs) [31], memories [32], photodetectors [33], solar cells [34], and synaptic devices [19,23,35]. Based on the basic synaptic functionalities of NW-based synaptic devices, NWs can be constructed for neuromorphic computing.…”
Section: Introductionmentioning
confidence: 99%
“…Compared with 2D materials, NWs are more suitable for high integration and low power consumption synaptic devices. Nowadays, NWs have been integrated into diodes [30], field effect transistors (FETs) [31], memories [32], photodetectors [33], solar cells [34], and synaptic devices [19,23,35]. Based on the basic synaptic functionalities of NW-based synaptic devices, NWs can be constructed for neuromorphic computing.…”
Section: Introductionmentioning
confidence: 99%
“…Silicon carbide (SiC) is currently attracting great interest due to the superior properties like wide energy bandgap, high thermal conductivity, high electron drift velocity, and excellent chemical and physical stability. , In applications, defects in SiC play a significant role, such as color centers in quantum applications, , Si-vacancy-related ferromagnetism in spintronic devices, and temperature monitors associated with defect recovery . It is well known that ion irradiation is widely used to introduce defects in materials in a controllable way. ,, Therefore, it could be foreseen that desired defects can be produced as expected by energetic ion irradiation if the defect generation rate is accurately known.…”
Section: Introductionmentioning
confidence: 99%
“…One of the leading and most important areas of research in the field of microelectronics is the study of the resistance of microelectronic devices and semiconductor devices to radiation, as well as the assessment of their degradation under operating conditions when exposed to ionizing radiation and increased background radiation [ 1 , 2 ]. This area of research has been of high relevance in recent years due to the increase in the number of manufactured devices and their areas of application, with the transition of most industries to robotization, as well as the complications and reduction in the geometric dimensions of microcircuits and semiconductor devices, which requires the abandonment of most traditional methods of protection against the negative effects of ionizing radiation [ 3 , 4 , 5 ]. This problem is especially acute in space technology and nuclear power engineering and when operating instruments under conditions of exposure to radiation, particularly with high-energy electrons, gamma radiation, protons or heavy ions [ 6 ].…”
Section: Introductionmentioning
confidence: 99%