Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing

Cheval, K.; Coulm, Jérémy; Gout, S.; Layouni, Y.; Lombard, Philippe; Léonard, Didier; Bessueille, François; Semet, V.; Cabrera, Michel

doi:10.4028/www.scientific.net/amr.1038.57

Cited by 8 publications

(4 citation statements)

References 5 publications

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“…Since 2012, each year, topics related to thin film technologies are supported to create new platforms with new practical work topics that fit into the challenges of both threedimensional integrated technologies, hybrid or large area technologies. These may concern the implementation of new technologies such as photovoltaic cells based on organic materials or perovskites, three-dimensional flexible boards in the field of plastronics [31], printed electronics on flexible substrates, but also new elementary components based on layers deposited by "Atomic Layer Deposition" that can improve the performance of elementary components by reducing leakage currents [32]. This is the case of memories whose use is increasing exponentially on the planet!…”

Section: Educational Challengesmentioning

confidence: 99%

(Invited) Progressive Involvement of Thin Film Technologies in Connected Objects to Meet New Societal Challenges

Bonnaud¹

2022

ECS Trans.

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This paper is part of a context of galloping evolution of digitalization of all societal areas. This invasion of digital systems and communication that may appear as a progress in many societal applications, as well create new limitations that must be quickly overcome. These limitations may have scientific, technical and technological origin, but also of a human origin, particularly with regard to the nature and the pool of skills, know-how, and innovation capabilities. This paper highlights the future challenges related to the exponential development of connected objects, and Internet of Things that leads to an effective power consumption growing exponentially as well. The different approaches to meet the challenges emphasize the role of microelectronics devices and systems and the potential interest of thin film technologies. It concludes with the human challenge, which is becoming a key point for the success of the digital extension at the global level.

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Section: Educational Challengesmentioning

confidence: 99%

(Invited) Progressive Involvement of Thin Film Technologies in Connected Objects to Meet New Societal Challenges

Bonnaud¹

2022

ECS Trans.

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“…Unfortunately, this reveals a physical limitation related to the distance between atoms and the quantum effects attached to them. But about fifteen years, this limitation has been overcome by playing on the third dimension [11], which makes it possible to have integrated systems of several thousand functions that can each contain billions of elementary components [12]. These results make it possible to have data processing systems in fabulous quantities in ever shorter times and have paved the way for connected objects, IoT, AI and the Industrial Revolution 4.0.…”

Section: Major Role Of Microelectronics Micro-and Nanotechnologiesmentioning

confidence: 99%

Innovative Strategy to Meet the Challenges of the Future Digital Society

Bonnaud

2021

Adv. technol. innov.

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Today, we are experiencing a societal revolution with the development of digital technologies, and it brings new challenges. Indeed, the number of connected objects, intelligent sensors and IoTs are increasing exponentially. The same goes for the resulting energy consumption. Beyond 2030, without a radical transformation of communication technologies and protocols, the digital world will be at an energy dead end. All these objects are physically realized with microelectronic devices and systems. This analysis of the microelectronics community has led the French government to recognize an electronics sector that is becoming a priority area of industrial policy. The Strategic Committee of this sector has proposed innovations applied to the entire digital chain including all facets of the microelectronics field and human skills and know-how. The technological and energy issues are thus presented, and the proposed solutions were addressed. They concern both technological and human aspects. This paper ends by giving examples of the implementation of innovative approaches which essentially include the electronic functions involved in connected objects and which are intended to bring the know-how of future actors in the field.

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“…The diversity of the topics is shown: from integrated devices in bulk silicon technology to silicon thin film transistors for displays, sensors or actuators [19], flexible electronics or radiofrequency circuits, and three dimension electronic on plastic (called "plastronics", for example [20]). Many other examples are available on the website of GIP-CNFM [1].…”

Section: Concrete Examples Of Innovative Practice Realized In the Cenmentioning

confidence: 99%

Mandatory Matching Between Microelectronics Industry and Higher Education in Engineering Toward a Digital Society

Bonnaud

2019

Smart Education and E-Learning 2019

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The evolution of the world towards the digital society requires the development of many connected objects, the basis of the Internet of Things (IoT), with a very wide spectrum of applications. These connected objects are based on communication protocols, embedded software but more fundamentally on the hardware that corresponds to the physical realization of the objects. Microelectronic technologies are therefore at the heart of all these devices and systems. This exponential evolution, is the result of more than fifty years of increasing integration, which is becoming very complex and combining many technological approaches and multidisciplinary architectures. The future industry 4.0 requires skills and competencies in microelectronic design and technological fabrication. At the same time, investments in manufacturing plants and design software follow the same exponential cost trend. To meet the needs of the industry, training must be constantly updated with good know-how on dedicated tools and equipment. To achieve this objective, higher education must be organized to provide students with knowledge and skills. A dedicated organization must be set up with common platforms that allow technological equipment and Computer-Aided-design tools (CAD) to be shared. This paper deals with the French national network which has proven its effectiveness in higher education in microelectronic engineering for more than thirty years. After a presentation of its organization and objectives, several examples of innovative practical work covering the different fields of application are given.

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Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing

Cited by 8 publications

References 5 publications

(Invited) Progressive Involvement of Thin Film Technologies in Connected Objects to Meet New Societal Challenges

(Invited) Progressive Involvement of Thin Film Technologies in Connected Objects to Meet New Societal Challenges

Innovative Strategy to Meet the Challenges of the Future Digital Society

Mandatory Matching Between Microelectronics Industry and Higher Education in Engineering Toward a Digital Society

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