Progress on the polymer composite insulating materials with high thermal conductivity

Electrospun polymer nanocomposites for thermal management: a review

“…where, λ total , λ s , λ g , λ r , and λ c represent the total TC, solid thermal conduction, gas thermal conduction, thermal radiation, and thermal convection, respectively, in eqn (1). C s , ν s , and l s represent the volumetric specific heat, velocity of phonons, and the mean free path of phonons in the solid, respectively, in eqn (2). λ g0 , η, α, l g , and d represent the TC of gas in the free space, the porosity, 2, the mean free path of gas, and the pore diameter, respectively, in eqn (3).…”

“…Therefore, it is extremely urgent to develop high thermal conductivity materials. 1,2 On the other hand, based on the global energy crisis caused by population growth and economic development, reducing energy waste and improving energy efficiency have received much attention. Developing high-performance thermal insulation materials to reduce heat transfer is one of the effective strategies.…”

Research progress of high thermal conductivity polyimide dielectric films

“…在导热填料部分提到的形成双网络结 构的PI膜 [55] , PAA/BNNS纤维和PVA/CNT纤 维通过共静电纺丝的技术制备, 这两种前驱体纤维 在膜中均匀交织, 前驱体膜经过高温处理后进行 PVA的炭化和PAA的热亚胺化, 从而制备PI复 合薄膜. Guo等 [113] 此外, 利用冰模板法 [108] 、冷冻干燥技术 [114] 图 16 PI复合材料的平面热导率(a)和跨平面热导率(b) [107] Fig. 16.…”

“…Duan等[107] 制备了一种新型 高导热PI介电复合材料, 填料颗粒(F-BA)由纳 米氮化硼(n-BN)和聚多巴胺包覆的球形氧化铝(PDA@Al 2 O 3 )组成, 为了改善填料与基体之间的 界面相容性, 创新性地使用1, 6-二异氰酸酯(HDI) 作为"桥接剂", 连接n-BN和PDA@Al 2 O 3 , 形成核-双壳结构的填料粒子. 含质量分数25% F-BA填 料的PI复合膜的平面方向和跨平面方向的热导率 分别为6.41, 1.01 W/(m•K), 是纯PI(0.18 W/(m•K)) 的36倍和6倍, 具体导热数据如图16.Dong等[108] 在 具 有 垂 直 排 列 的 各 向 异 性 的 BNNS/PI材料中加入AgNWs作为"导热桥", 形 成相互连通的导热网络, 当BNNS-AgNWs的填充 量为20%(质量分数)时, 复合材料的面内导热率 达到4.75 W/(m•K). 与未加入AgNWs的材料相 比…”